Peltier cooling systems with high aspect ratio

Abstract

New Peltier semiconductor heat transfer systems are presented herein. In particular, Peltier heat transfer systems of Peltier semiconductor elements of highly unique shape are arranged to bias the cooling side with respect to its size and consequently performance. In effect, a Peltier heat transfer system is created whereby the Peltier called side is greatly reduced in size and the Peltier hot side is greatly expanded in size. Such ‘high aspect ratio’ Peltier systems promote ‘focused’ cooling effect, which is particularly useful in conjunction with high-performance electronic devices having a small footprint. The entire cooling a fact of the Peltier device is brought to the small space approximated by a point. Thus a ‘point’ heat source such as a semiconductor laser are high-performance light emitting diode is more effectively cooled by these systems.

Description

CONTINUING INFORMATION [0001] This application is a continuation of a previously filed application having a Ser. No. of 10 / 545,216 filed Aug. 04, 2005; which is a U.S. national application depending from PCT application PCT / IB2004 / 000202 which benefits from priority established as U.S. application Ser. No. 10 / 360,955 filed Jul. 02, 2003, now abandoned.BACKGROUND OF THE INVENTIONS [0002] 1. Field [0003] The following inventions disclosure is generally concerned with semiconductor cooling systems in high performance electronic devices and specifically concerned with Peltier semiconductor elements of non-rectilinear shapes arranged to provide a spatial concentration of the heat transfer effects. [0004] 2. Prior Art [0005] US patent application publication No. 2004 / 0120156 published on Jun. 24, 2004 by inventor Ryan of the Riversdale, N.Y., teaches of a high-powered lighting assembly, which includes an easily sealed continuous thermal barrier and a solid-state actively controlled closed...

AI Technical Summary

Benefits of technology

[0016] Peltier elements of special geometric shape and design are arranged provide a ‘focused’ or concentrated cooling effect and deliver that cooling mechanism to a very small size and geometry. In this manner, point-type heat sources such as high-performance electronic devices, in example a laser, high output or otherwise high-performance LED, may be more effectively cooled as the cooling capacity of these Peltier heat transfer systems is more directly coupled to such devices in view of their intrinsic geometry.

[0018] When used in combination with high-performance LEDs, these three-dimensional Peltier heat transfer systems deliver the highest cooling effect to the LED junction, which permits these high-performance LEDs to be driven with greater currents and thus at higher optical outputs. Thus these three-dimensional Peltier heat transfer systems when used in combination with high-performance electronic devices having a point-type heat source profile, always permit better performance. OBJECTIVES OF THESE INVENTIONS

Problems solved by technology

The systems of Kimura illustrate a primary deficiency in found throughout the art, that is the use of rectilinear Peltier elements to cool point-type heat sources is inefficient at best, because the “cold side” is embodied as a plane which occupies an extensive area while heat production occurs at a very tiny point.

It is very hard to effectively couple a large planar surface to a point-type heat source as the coupling's efficiency depends on thermal conduction in the cold plane.

While systems and inventions of the art are designed to achieve particular goals and objectives, some of those being no less than remarkable, these inventions have limitations which prevent their use in new ways now possible.

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