Peltier cooling systems with high aspect ratio

Abstract

New Peltier semiconductor heat transfer systems are presented herein. In particular, Peltier heat transfer systems of Peltier semiconductor elements of highly unique shape are arranged to bias the cooling side with respect to its size and consequently performance. In effect, a Peltier heat transfer system is created whereby the Peltier called side is greatly reduced in size and the Peltier hot side is greatly expanded in size. Such ‘high aspect ratio’ Peltier systems promote ‘focused’ cooling effect, which is particularly useful in conjunction with high-performance electronic devices having a small footprint. The entire cooling a fact of the Peltier device is brought to the small space approximated by a point. Thus a ‘point’ heat source such as a semiconductor laser are high-performance light emitting diode is more effectively cooled by these systems.

Description

CONTINUING INFORMATION [0001] This application is a continuation of a previously filed application having a Ser. No. of 10 / 545,216 filed Aug. 04, 2005; which is a U.S. national application depending from PCT application PCT / IB2004 / 000202 which benefits from priority established as U.S. application Ser. No. 10 / 360,955 filed Jul. 02, 2003, now abandoned.BACKGROUND OF THE INVENTIONS [0002] 1. Field [0003] The following inventions disclosure is generally concerned with semiconductor cooling systems in high performance electronic devices and specifically concerned with Peltier semiconductor elements of non-rectilinear shapes arranged to provide a spatial concentration of the heat transfer effects. [0004] 2. Prior Art [0005] US patent application publication No. 2004 / 0120156 published on Jun. 24, 2004 by inventor Ryan of the Riversdale, N.Y., teaches of a high-powered lighting assembly, which includes an easily sealed continuous thermal barrier and a solid-state actively controlled closed...

AI Technical Summary

Benefits of technology

[0014] Comes now: Abramov, V.S.; Ivanov, A.A.; Shishov, A.V.; Sherbakov, N.V.; and Sushkov, V.P., with inventions of Peltier effect cooling systems having a high aspect ratio with respect to its hot and cold sides. These inventions include devices configured in conjunction with high performance electronic elements characterized as having a very small footprint. In some most preferred versions, these systems include a Peltier heat transfer systems having a spatial bias in conjunction with a plurality of LEDs arranged in an array.

[0015] It is a primary function of these Peltier cooling systems to provide highly concentrated cooling effect to size limited devices and geometries. It is a contrast to prior art methods and devices that those systems do not provi

Problems solved by technology

The systems of Kimura illustrate a primary deficiency in found throughout the art, that is the use of rectilinear Peltier elements to cool point-type heat sources is inefficient at best, because the “cold side” is embodied as a plane which occupies an extensive area while heat production occurs at a very tiny point.

It is very hard to effectively couple

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