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Method of manufacturing wiring board, and liquid ejection head having wiring board

a liquid ejection head and wiring board technology, which is applied in the direction of liquid/solution decomposition chemical coating, superimposed coating process, coating, etc., can solve the problems of large amount of waste, complex manufacturing process, and one-shot molding method that requires a complicated manufacturing process, etc., to achieve improved close adhesion of conductive metal to the flow channel (groove) and high density

Inactive Publication Date: 2007-02-01
FUJIFILM CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention provides a method of manufacturing a wiring board and a liquid ejection head with improved plating processes, adhesion, and the ability to form wires on a freely designed surface. The method involves forming a flow channel by covering a groove in a resin substrate and depositing a liquid containing conductive metal into the flow channel. The liquid ejection head includes a plurality of pressure chambers connected to nozzles ejecting liquid, a diaphragm, and an ejection device structure. The invention also provides a method of inducing electroless plating on a resin substrate by using an ion exchange group and a reducing agent. The invention also allows for the formation of wires on both surfaces of the substrate and reduces the steps in the conducting layer formation process. The invention also provides a conductive paste for use in the wiring process and a method of forming grooves in the resin substrate. Overall, the invention improves the efficiency and flexibility of wiring board and liquid ejection head manufacturing.

Problems solved by technology

However, the two-shot molding method involves a large amount of waste, since it uses the plating catalyst for the whole of the primary molding object, and furthermore, the manufacturing process becomes complex, since it requires two molding steps: primary molding and secondary molding.
The one-shot molding method requires a complicated manufacturing process, and also creates wasted material.
What is more, if surface roughening is carried out by using strongly acidic chemicals, such as chromic acids, in addition to problems relating to environmental suitability, there is also a drawback in that if the plating in the regions outside the mask is removed by sandblasting with micro-particles, or the like, then scratches are liable to occur due to the scattering of the micro-particles, and non-uniformities arise.
However, in the method disclosed in Japanese Patent Application Publication No. 2002-270995, desired conducting layers are formed after surface roughening by wet blasting and selective catalytic activation (patterning) by UV or heat treatment; however, the selective catalytic activation by UV irradiation or heat treatment is substantially a patterning step, and hence there is no substantial reduction in the number of plating steps.
Furthermore, there is also a problem in that it is difficult to carry out patterning by UV irradiation or heat treatment, on the surface of the resin molding that has been formed freely to a desired shape.
Since the patterning of the conducting layers is carried out by electrophotography, then it is impossible to achieve a resolution exceeding the resolution of the electrophotographic process.
Furthermore, it is difficult to carry out patterning by electrophotography on the surface of a resin molding that has been formed freely to a desired shape.

Method used

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  • Method of manufacturing wiring board, and liquid ejection head having wiring board
  • Method of manufacturing wiring board, and liquid ejection head having wiring board
  • Method of manufacturing wiring board, and liquid ejection head having wiring board

Examples

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first embodiment

[0054]FIGS. 1A to 3 show a method of manufacturing a wiring board according to the present invention.

[0055] The method of manufacturing a wiring board according to the present embodiment involves: forming a substrate having grooves by resin molding, forming flow channels by closing off the grooves after they have been formed, introducing a liquid containing a conductive metal (namely, an active plating catalyst material, in other words, a material which induces electroless precipitation of the metal that is to be plated when it makes contact with an electroless plating solution; hereinafter simply referred to as a “plating catalyst”), into the flow channels, thereby depositing the catalyst onto the grooves, and forming conducting layers which will become electrical wires on the substrate, by means of electroless plating or electrolytic plating.

[0056] Firstly, a substrate 10 having grooves 12 is formed by resin molding, as shown in FIG. 1A. Here, for the purpose of the description, ...

second embodiment

[0070] Next, the present invention is described.

[0071] In this second embodiment, the surface roughness of the inner sides of the grooves is controlled to a suitable value in order to improve anchoring effects which enhance the adhesion of the plating to the interior of the grooves which form the electrical wires. More specifically, the surface roughness of the interior of the grooves is set to Ra 0.4 or above in order to improve the adhesion (anchoring effect) of the plating, and the close contact face with the covering member (closing member) which forms the flow channels by covering the grooves is formed with a surface roughness of Ra 0.2 or below.

[0072] In practice, in order to form surface roughness of this kind on the interior of the grooves of a substrate formed with grooves, and on the close contact face with the covering member, a surface roughness is previously formed in this manner on the mold used for resin molding of the substrate, in the portions corresponding to the ...

third embodiment

[0075] Next, the present invention is described.

[0076] In this third embodiment, grooves are formed in a substrate by means of a mold.

[0077] There are three types of method for forming the grooves: the grooves may be molded in a thermally curable epoxy resin, or molded in a resin that is curable by irradiation of energy, or alternatively, the grooves may be formed by means of a hot press (heating and pressurization).

[0078] Firstly, molding the grooves in a thermally curable epoxy resin is the same as the method described in FIGS. 4A and 4B. If a thermally curable epoxy resin which has been heated and melted is molded by being introduced into a metal mold, then since the thermally curable epoxy resin has good fluidity, it has highly beneficial properties for forming grooves for high-density wiring.

[0079] Next, FIG. 5 shows a molding method using ultraviolet (UV) curable resin. As shown in FIG. 5, the groove forming mold in this case is formed with projection-shaped sections 30a co...

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Abstract

The method of manufacturing a wiring board comprises the steps of: forming a flow channel by covering a groove formed in a resin substrate by means of a covering member; and filling a liquid containing conductive metal into the flow channel, and depositing the conductive metal onto wall faces of the flow channel.

Description

BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention [0002] The present invention relates to a method of manufacturing a wiring board, and a liquid ejection head having the wiring board, and more particularly to manufacturing technology for a wiring board in which plating wires are formed in grooves formed by resin molding. [0003] 2. Description of the Related Art [0004] Circuit wiring technology for performing high-density installation has been developed for electronic devices, in order to achieve size and weight reductions, and high functionality, in such devices. [0005] For example, a two-shot molding method and a one-shot molding method are known for manufacturing circuit components having conductive circuit wires formed on a substrate made of synthetic resin. [0006] In the two-shot molding method, firstly, primary molding is carried out using a resin containing a plating catalyst, whereupon surface roughening (etching) is performed on the primary molding object. Alterna...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): C23C28/00
CPCC23C18/28C23C26/02C25D5/34H05K3/107H05K2203/0716H05K3/181H05K2201/09036H05K2201/09118H05K2201/09981H05K3/1258
Inventor KACHI, YASUHIKOOTA, HIROSHI
Owner FUJIFILM CORP