Dielectric device

a technology of dielectric devices and films, applied in the direction of electrode system manufacturing, device material selection, electric discharge tube/lamp manufacturing, etc., can solve the problems of fine metal particles not necessarily uniformly dispersed in the film layer, and fine metal particles may be non-uniformly dispersed, etc., to suppress impairment of properties, high efficiency, and high dielectric constant
US20070222067A1Inactive Publication Date: 2007-09-27NGK INSULATORS LTD
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Patent Information

Authority / Receiving Office
US · United States
Current Assignee / Owner
NGK INSULATORS LTD
Publication Date
2007-09-27
Estimated Expiration
Not applicable · inactive patent

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Abstract

The dielectric device includes a substrate, a lower electrode, a dielectric layer, and an upper electrode. The lower electrode is bonded onto the substrate. The dielectric layer is bonded onto the lower electrode. The dielectric layer is obtained through thermal treatment of a film layer formed by spraying of a powdery dielectric material and a fine-particulate metal. In the thus-formed film layer, the metal is dispersed in the matrix of the dielectric material. Thermal treatment of the film layer causes migration of the metal in the film layer. This metal migration causes a lower-electrode-adjacent portion and upper-surface-adjacent portion of the dielectric layer to have different metal contents.
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Description

BACKGROUND OF THE INVENTION

[0001] 1. Field of the Invention

[0002] The present invention relates to a dielectric device including a dielectric layer, and to a method for producing the dielectric device.

[0003] 2. Description of the Related Art

[0004] A variety of dielectric devices of this type have conventionally been known. Generally, such a dielectric device includes, in addition to a dielectric layer, a predetermined substrate, a lower electrode layer, and an upper electrode. The lower electrode layer is formed on the substrate. The dielectric layer is formed on the lower electrode layer. The upper electrode is formed on the dielectric layer. The dielectric layer is formed by subjecting the lower-electrode-layer-formed substrate to film formation through, for example, the screen printing process, the green sheet process, aerosol deposition method, or powder jet deposition method.

[0005] The screen printing process is a technique in which a substrate is coated, through screen printing, wi...

Claims

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