Cleaning wafer including detergent layer for exposure apparatus of immersion lithography system, composition of detergent layer, method of using cleaning wafer and application system

Abstract

A method of an in situ cleaning of an objective lens of a semiconductor apparatus includes placing a cleaning wafer having a detergent layer on a scanning stage of the semiconductor apparatus. A cleaning composition in the detergent layer is dissolved by using an immersion liquid (water), so that the cleaning composition reacts with the contaminants on the objective lens. Thereafter, the objective lens is rinsed with another solvent.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of Invention[0002]The present invention relates to a method and an apparatus for cleaning a semiconductor system. More particularly, the present invention is related to a cleaning wafer applicable to an exposure apparatus of an immersion lithography system and an objective lens of the exposure apparatus, an in situ cleaning method using the cleaning wafer, and a composition of a coating layer of the cleaning wafer.[0003]2. Description of Related Art[0004]In the semiconductor industry, methods used in scaling down the linewidth typically include reducing the wavelength of an exposure light to enhance resolution. However, the new-generation 157 nm lithograph process confronts with numerous problems, such as the application of brand new laser source, photomask, objective lenses that can reduce the image and exposure light positions, and photoresist reagent, etc. Below 157 nm, it is difficult to fabricate lenses of calcium fluoride for the lense...

AI Technical Summary

Benefits of technology

The present invention provides an apparatus and method for effectively cleaning the objective lens of a semiconductor apparatus without the need for the vendor's assistance. The cleaning apparatus is easy to operate, cost-effective, and does not require additional space. The cleaning method involves using a cleaning wafer with a detergent layer that contains a cleaning component, which is dissolved in a solvent to react with contaminants on the objective lens. The cleaning wafer can be easily fabricated and used in a semiconductor process for cleaning the objective lens. The invention also provides a composition for forming the cleaning wafer and a method for fabricating it. Overall, the invention provides a simple and effective solution for cleaning semiconductor apparatuses without the need for additional tools or resources.

Problems solved by technology

However, the new-generation 157 nm lithograph process confronts with numerous problems, such as the application of brand new laser source, photomask, objective lenses that can reduce the image and exposure light positions, and photoresist reagent, etc.

Below 157 nm, it is difficult to fabricate lenses of calcium fluoride for the lenses either have too many defects or significant aberrations are resulted.

Ultimately, it is unable to project a clear image onto the wafer.

Further, during the exposure process, the dissolved substance in the photoresist is evaporated and outgassing is resulted, which ultimately may deposit on and contaminate the objective lens.

Not only the cleaning of the objective lens is time consuming and costly, the objective lens is often not completely cleaned, which then requires a re-cleaning of the objective lens.

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