Thermosetting encapsulation adhesive sheet

US20080286562A1Inactive Publication Date: 2008-11-20NITTO DENKO CORP
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  • Thermosetting encapsulation adhesive sheet
  • Thermosetting encapsulation adhesive sheet

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examples

[0040]Inventive examples will hereinafter be described in conjunction with comparative examples. However, it should be understood that the present invention be not limited to these inventive examples.

[0041]First, the following ingredients were prepared.

Epoxy resin-a: A naphthalenediol epoxy resin (ESN-355 available from Tohto Kasei Co., Ltd.)

Epoxy resin-b: A bisphenol-A epoxy resin (EPICOAT 828 available from Japan Epoxy Resin Co., Ltd.)

Epoxy resin-c: A trishydroxyphenylmethane epoxy resin (EPPN-501HY available from Nippon Kayaku Co., Ltd.)

Phenol resin-a: A novolak phenol resin (H-4 available from Meiwa Plastic Industries, Ltd.)

Phenol resin-b: A novolak phenol resin (DL-65 available from Meiwa Plastic Industries, Ltd.)

Acryl resin-a: An acryl copolymer (TEISAN RESIN SG-70L available from Nagase ChemteX Corporation)

Acryl resin-b: An acryl copolymer (TEISAN RESIN SG-P3 available from Nagase ChemteX Corporation)

Curing accelerating agent-a: Tetraphenylphosphonium tetraphenylborate (TPP-K...

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Abstract

A thermosetting encapsulation adhesive sheet which is used for encapsulating a chip type device (1) having connection electrodes (bumps) (3) and mounted on a wiring circuit board (2). The thermosetting encapsulation adhesive sheet is composed of an epoxy resin composition having a viscosity of 5×104 to 5×106 Pa·s as measured at a temperature of 80 to 120° C. before thermosetting thereof. The thermosetting encapsulation adhesive sheet makes it possible to conveniently encapsulate a hollow device with an improved yield.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to a thermosetting adhesive sheet to be employed for encapsulating a chip type device and, more specifically, to a thermosetting adhesive sheet to be employed for encapsulating a so-called hollow device, such as a surface acoustic wave device (SAW device), a quartz device, a high frequency device or an acceleration sensor, which is required to have a hollow surface.[0003]2. Description of the Related Art[0004]Conventionally, encapsulation of a chip type device such as a semiconductor element or an electronic component is achieved by a transfer molding method employing a powdery epoxy resin composition, or a potting method, a dispensing method or a printing method employing a liquid epoxy resin composition, a silicone resin or the like. These encapsulation methods require an expensive molding machine, and suffer from a problem such that the encapsulation resin adheres to unwanted portions of...

Claims

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Application Information

Patent Timeline
20 Nov 2008
Publication
US20080286562A1
IPC
B32B5/02
CPC
C08L33/00; C09J163/00; Y10T428/2852; Y10T428/254; Y10T428/287; C08L2666/04; H01L2924/181; H01L2224/16225
Inventors
TOYODA, EIJI; NORO, HIROSHI