Thermosetting encapsulation adhesive sheet

US20080286562A1Inactive Publication Date: 2008-11-20NITTO DENKO CORP
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Patent Information

Authority / Receiving Office
US · United States
Current Assignee / Owner
NITTO DENKO CORP
Publication Date
2008-11-20
Estimated Expiration
Not applicable · inactive patent

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Abstract

A thermosetting encapsulation adhesive sheet which is used for encapsulating a chip type device (1) having connection electrodes (bumps) (3) and mounted on a wiring circuit board (2). The thermosetting encapsulation adhesive sheet is composed of an epoxy resin composition having a viscosity of 5×104 to 5×106 Pa·s as measured at a temperature of 80 to 120° C. before thermosetting thereof. The thermosetting encapsulation adhesive sheet makes it possible to conveniently encapsulate a hollow device with an improved yield.
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Description

BACKGROUND OF THE INVENTION

[0001] 1. Field of the Invention

[0002] The present invention relates to a thermosetting adhesive sheet to be employed for encapsulating a chip type device and, more specifically, to a thermosetting adhesive sheet to be employed for encapsulating a so-called hollow device, such as a surface acoustic wave device (SAW device), a quartz device, a high frequency device or an acceleration sensor, which is required to have a hollow surface.

[0003] 2. Description of the Related Art

[0004] Conventionally, encapsulation of a chip type device such as a semiconductor element or an electronic component is achieved by a transfer molding method employing a powdery epoxy resin composition, or a potting method, a dispensing method or a printing method employing a liquid epoxy resin composition, a silicone resin or the like. These encapsulation methods require an expensive molding machine, and suffer from a problem such that the encapsulation resin adheres to unwanted portions of...

Claims

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