Optical semiconductor device, socket, and optical semiconductor unit

Inactive Publication Date: 2010-09-16
JAPAN AVIATION ELECTRONICS IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Benefits of technology

[0014]According to the present invention, the electrode portion has a block shape in external appearance. With this structure, heat generated in the optical semiconductor device is transferred through an electrode to a substrate to cool the optical semiconductor device. Th

Problems solved by technology

However, if the LED device increased in luminance has a small-sized and replaceable connector-type structure as disclosed in Patent Documents 1 and 2, it is not possible to sufficiently cool the heat generated from the LED device.
Accordingly, there is a problem that the temperature of the LED device itself is increased to cause deterioration of the LED device itsel

Method used

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  • Optical semiconductor device, socket, and optical semiconductor unit
  • Optical semiconductor device, socket, and optical semiconductor unit
  • Optical semiconductor device, socket, and optical semiconductor unit

Examples

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Example

Example 1

[0115]According to the design method using the finite element method described in the first embodiment, volumes of the main body 7 and the electrode portions 13a and 13b of the LED device 3 were calculated so as to optimize the thermal property data.

[0116]The LED 9 had a size of 1 mm square and a height of 0.1 mm. A thermal conductivity of the LED 9 and an input power supplied to the LED 9 were 42 W / mK and 1 W (at a room temperature), respectively.

[0117]A junction temperature of the LED 9 was 200° C. and the substrate 6a was a glass-epoxy substrate (FR-4) having a size of 50 mm square and a thickness of 0.8 mm.

[0118]As a material of the main body 7, Al2O3 (having a thermal conductivity of 18 W / mK) was used. As a material of the electrode portions 13a and 13b, oxygen-free copper (having a thermal conductivity of 390 W / mK) was used. Then, a relationship between a volume of the main body 7 and a temperature of the LED 9 and a relationship between a volume of the electrode port...

Example

Example 2

[0122]According to the design method using the finite element method described in the first embodiment, comparison was made between junction temperatures of the LED 9 when the socket 5 according to the first embodiment was used and when the socket 5a according to the fourth embodiment was used.

[0123]Specifically, each of the eleven socket terminals 19a and the eleven socket terminals 19b of the socket 5 had a width of 0.2 mm and these socket terminals were disposed at a distance of 0.2 mm from one another. On the other hand, each of the four socket terminals 43a and the four socket terminals 43b of the socket 5a had a width of 0.91 mm and these socket terminals were disposed at a distance of 0.2 mm from one another. For all of those socket terminals, a contact length in a direction perpendicular to a width direction of each socket terminal was 0.92 mm.

[0124]As a material of the socket terminal, phosphor bronze (having a thermal conductivity of 63 W / mK) and a copper alloy (h...

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Abstract

An optical semiconductor unit of the present invention has an LED device provided with an LED (Light Emitting Diode) and a socket to which the LED device is mounted, the LED device has a main body to which the LED is mounted, the main body has a first surface to which block-shaped electrode portions are connected.

Description

[0001]This application is based upon and claims the benefit of priority from Japanese Patent Application No. 2009-058463, filed on Mar. 11, 2009, the disclosure of which is incorporated herein in its entirety by reference.BACKGROUND OF THE INVENTION[0002]This invention relates to an optical semiconductor device, a socket for mounting the optical semiconductor device thereto, and an optical semiconductor unit.[0003]Formerly, an LED (Light Emitting Diode) device as a typical optical semiconductor device was fixed to a substrate by soldering and used.[0004]However, if the LED device is fixed to the substrate, replacement of the LED device is difficult and troublesome. In view of the above, an LED device of a replaceable connector type has been proposed as disclosed in JP-A-2001-24216 (Patent Document 1) and JP-A-2008-288221 (Patent Document 2).[0005]It is said that the LED device generates less heat as compared to a common light source using a filament or the like. However, in recent y...

Claims

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Application Information

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IPC IPC(8): H01L33/62G06F17/50
CPCH01R13/20H05K3/301H05K2201/10106G06F17/5072H01R12/716H01R12/7076H05K2201/10325G06F30/392
Inventor KANNO, HIDEYUKI
Owner JAPAN AVIATION ELECTRONICS IND LTD
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