Label sheet for cleaning and conveying member having cleaning function

Abstract

A label sheet for cleaning is formed of a label for cleaning including a cleaning layer having a 180° peeling adhesion to a silicon wafer of 0.20 N / 10 mm or less after receiving an active energy and an adhesive layer provided on one of surfaces of said cleaning layer, and a separator on which the label is removably provided through the adhesive layer.

Description

[0001]This is a continuation of application Ser. No. 10 / 297,184 filed Dec. 3, 2002, which is a 371 Application of PCT / JP01 / 03850 filed May 8, 2001, which claims priority from Japanese Patent Application No. 2001-109405 filed Apr. 9, 2001 and Japanese Patent Application No. 2001-111791 filed Apr. 10, 2001. The entire disclosures of the prior applications are hereby incorporated by reference.TECHNICAL FIELD[0002]The present invention relates to a label sheet for cleaning equipment, and a label sheet for cleaning on a conveying member for use in a clean substrate processing apparatus, for example, manufacturing equipment or checking equipment for a semiconductor, a flat panel display or a printed board.BACKGROUND ART[0003]Various forms of substrate processing equipment utilize a conveying system to convey a substrate in physical contact with the conveying system. In this case, if foreign matters stick to the substrate or the conveying system, succeeding substrates are successively cont...

AI Technical Summary

Benefits of technology

[0008]In view of the above, it is an object of the invention to provide a label sheet for cleaning which: can be reliably conveyed on a substrate in substrate processing equipment; removes foreign matter sticking in the equipment easily and reliably; enhances a working efficiency; and generates no refuse because sheet cutting is not required after bonding to the substrate.

[0009]It is another object of the invention to provide a method of manufacturing a label sheet for cleaning which: can be reliably conveyed on a substrate in substrate processing equipment; removes foreign matters sticking into the equipment easily and reliably; and results neither in defective punching during sheet punching nor in defective adhesive curing in a precutting method.

[0010]In one aspect of the invention, when the cleaning sheet or the substrate having the sheet fastened thereto is conveyed to remove foreign matter sticking in substrate processing equipment, setting an adhesion to a specific value or less using an active energy source and setting the cleaning sheet to have the label shape results in easy and reliable removal of the foreign matter without the troubles described above.

Problems solved by technology

In this case, if foreign matters stick to the substrate or the conveying system, succeeding substrates are successively contaminated.

For this reason, there is a problem in that an availability factor of the equipment is reduced and a great deal of labor is required.

Of these methods, the method of removing foreign matter by conveying a plate-shaped member allows easy conveyance of the plate-shaped member, but is relatively less effective in cleaning foreign matter.

However, there is a possibility that the adhesive substance and a portion of the equipment might be bonded too strongly to be removed.

Therefore, the substrate might not be conveyed reliably.

In particular, when a pressure reducing absorption mechanism is used for a chuck table of the equipment, this problem is prevalent.

However, in such a method, refuse from the cut away portion might be generated and might stick to the substrate or the equipment.

In some cases, however, an adhesive of the cleaning sheet might leak out of a punched surface during the sheet punching and might stick to an end of the cleaning sheet or substrate so that an appearance is deteriorated or conveyance troubles are caused.

Furthermore, in the case in which an adhesive of a polymerization and curing type is used, the adhesive on the end of the cleaning sheet causes defective curing by polymerization inhibition due to oxygen inhibition if the curing is carried out after the sheet punching.

Therefore, the contact portion of the substrate processing equipment might be contaminated by the adhesive.

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