Plasma texturing reaction apparatus

Abstract

A plasma texturing reaction apparatus includes a chamber including a dielectric window and a chamber body and receiving a solar cell wafer to be textured, and a polygonal induction coil provided at an outer upper portion of the dielectric window to generate a magnetic field for generating plasma, a high frequency low power supply unit that supplies a cathode of the chamber with high frequency power corresponding to process conditions, and a high frequency source power supply unit that supplies the polygonal induction coil with high frequency power.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to a plasma texturing technology for a solar cell, and more particularly, to a plasma texturing reaction apparatus which can improve the manufacturing efficiency and quality of a solar cell by increasing the density and uniformity of plasma ions and appropriately controlling ion energy when conducting plasma texturing through dry etching on a solar cell wafer to increase a light absorption amount of available light to the inside of the solar cell by reducing a light reflection amount on the surface of the solar cell.[0003]2. Description of the Related Art[0004]A solar cell is a photoelectric element which converts light energy into electrical energy. The solar cell is considered as a clean energy source which can overcome problems such as environmental pollution, high fuel cost, etc. caused by the use of fossil fuel energy.[0005]Recently, research has been actively conducted to improve the ...

AI Technical Summary

Benefits of technology

[0011]Accordingly, the present invention has been made in an effort to solve the problems occurring in the related art, and an object of the present invention is to increase the density and uniformity of plasma ions and appropriately control ion energy by using a square induction coil when conducting plasma texturing through dry etching on a solar cell wafer.

Problems solved by technology

As a consequence, it is difficult to apply the surface texturing to an ultrathin wafer.

According to the solenoid type plasma reaction apparatus, since an inductance value is relatively high and a sputtering problem due to a high voltage occurs, efficiency may be reduced.

According to the planar type plasma reaction apparatus, since the distance between a plasma source and a wafer is short, it may be difficult to independently adjust ion energy reaching the surface of the wafer.

According to the dome type plasma reaction apparatus, since the area of a substrate is increased, it may be difficult to ensure a uniform etching rate.

However, since a solar cell wafer has a rectangular or square shape, when using the conventional plasma reaction apparatus, it may be difficult to ensure a uniform etching rate across the wafer.

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