Cooler having ground heated plane for cooling heating electronic component

Abstract

A method for making heated plane of a cooler to obtain better flatness and roughness includes a grinder with a grinding plate and a fixture. Then, the cooler is arranged onto the fixture. Next, the abrasive is injected into the gap between the grinding plate and the heated plane, making the fixture press and clamp the cooler in a way, such that the heated plane of the cooler contacts the abrasive closely. Finally, the grinding plate is rotated to make at least one grinding process to the heated plane, making the heated plane obtain a surface with better roughness and flatness, further enhancing the contact tightness between the heated plane and a heating element, and therefore promoting the thermally conductive efficiency between the cooler and the heating element.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS [0001]This application is a divisional application of U.S. application Ser. No. 12 / 482,000 filed on Jun. 10, 2009. The entire disclosure is incorporated herein by reference.BACKGROUND OF THE INVENTION [0002]1. Field of the Invention[0003]The present invention in general relates to a cooler, in particular, to a cooler, a heated plane of which is ground, and to a grinding method thereof.[0004]2. Description of Prior Art[0005]Following progress of technology, computer hardware is developed toward the directions of high speed and high frequency for increasing its execution efficiency, but its power consumption is also increased relatively. Compared to the prior arts, the heat generated from today's electronic component is much more significant than the past's. If the accumulative heat is not removed in time, the electronic component will be overheated to lower down the operation efficiency, even cause damage. So, most electronic component needs co...

AI Technical Summary

Benefits of technology

"The invention is about improving the surface roughness and flatness of a cooler used for cooling electronic components. This is achieved by grinding the heated surface of the cooler using a fixture that presses and clamps the cooler in close contact with an abrasive. The grinding process results in a better contact between the cooler and the heating electronic component, increasing the efficiency of heat transfer and reducing the likelihood of failure. The invention also includes a method and apparatus for grinding the heated surface of a cooler."

Problems solved by technology

Following progress of technology, computer hardware is developed toward the directions of high speed and high frequency for increasing its execution efficiency, but its power consumption is also increased relatively.

If the accumulative heat is not removed in time, the electronic component will be overheated to lower down the operation efficiency, even cause damage.

However, since of the limitation of many factors, such as cooling space and power consumption, how to promote cooling efficiency as high as we can becomes an issue intended to be addressed urgently by industry.

However, in practice, the roughness and flatness on the surface of the heated face is still poor, making the heated face and the heating component unable to be contacted closely, thereby, limiting the thermal conduction between the heated face and the heating electronic component.

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