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Aluminum plating solution, aluminum film, resin structure, porous aluminum object, and porous aluminum object manufacturing method

a technology of aluminum film and manufacturing method, which is applied in the direction of 3d structure electroforming, electrolysis process, electroforming process, etc., can solve the problems of increasing the liquid temperature due to joule heat, and increasing the electric power cos

Inactive Publication Date: 2016-12-22
SUMITOMO ELECTRIC IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention provides an aluminum plating solution that has a wide current density range and a low solution resistance. This means that the solution can be used for aluminum plating with a high degree of flexibility and ease of use.

Problems solved by technology

If the electrical conductivity of a plating solution is low, the solution resistance is increased, and the voltage necessary for allowing a certain amount of current to flow increases, resulting in an increase in the electric power cost.
Furthermore, with the increase in the voltage, an increase in the liquid temperature due to Joule heat also occurs.
Accordingly, equipment for cooling the plating solution is also necessary in order to make the plating conditions constant, and thus the electric power cost further increases.
For these reasons, the use of a plating solution that can be used for plating at a high current density and has high productivity increases the electric power cost as a whole.

Method used

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  • Aluminum plating solution, aluminum film, resin structure, porous aluminum object, and porous aluminum object manufacturing method

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0067]Aluminum chloride and 1-ethyl-3-methylimidazolium chloride (EMIC) were mixed so that the molar ratio became 2:1 to prepare an ionic liquid 1. Methylammonium chloride, which is a primary ammonium salt, was further added to the ionic liquid 1 so as to have a concentration of 15 g / L. Thus, an aluminum plating solution 1 was prepared.

[0068]Electrical conductivities of the ionic liquid 1 and the aluminum plating solution 1 were measured and compared. According to the results, it was confirmed that the electrical conductivity of the aluminum plating solution 1 was increased by 11%. The electrical conductivities were measured by an alternating current impedance method.

example 2

[0069]Dimethylamine hydrochloride, which is a secondary ammonium salt, was further added to the ionic liquid 1 prepared in Example 1 so as to have a concentration of 27 g / L. Thus, an aluminum plating solution 2 was prepared.

[0070]Electrical conductivities of the ionic liquid 1 and the aluminum plating solution 2 were measured and compared. According to the results, it was confirmed that the electrical conductivity of the aluminum plating solution 2 was increased by 20%.

example 3

[0071]Trimethylammonium chloride, which is a tertiary ammonium salt, was further added to the ionic liquid 1 prepared in Example 1 so as to have a concentration of 21 g / L. Thus, an aluminum plating solution 3 was prepared.

[0072]Electrical conductivities of the ionic liquid 1 and the aluminum plating solution 3 were measured and compared. According to the results, it was confirmed that the electrical conductivity of the aluminum plating solution 3 was increased by 13%.

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Abstract

Provided is an aluminum plating solution that has a wide current density range in which aluminum plating can be performed and that has a low solution resistance. The aluminum plating solution contains an aluminum halide, at least one selected from the group consisting of an alkylimidazolium halide, an alkylpyridinium halide, and a urea compound, and an ammonium salt represented by the general formula (1) below. A concentration of the ammonium salt is 1 g / L or more and 45 g / L or less.NR4+.X−  General formula (1)In the general formula, R each represent a hydrogen atom or an alkyl group which may have a side chain and which has 15 or less carbon atoms, X represents a halogen atom, and R may be the same or different from each other.

Description

TECHNICAL FIELD[0001]The present invention relates to an aluminum plating solution, an aluminum film, a resin structure, a porous aluminum object, and a porous aluminum object manufacturing method.BACKGROUND ART[0002]Porous metal objects having a three-dimensional network structure are used in various applications such as filters, catalyst supports, and battery electrodes. For example, Celmet (manufactured by Sumitomo Electric Industries, Ltd.: registered trademark) formed of a porous nickel object having a three-dimensional network structure (hereinafter referred to as “porous nickel object”) is used as an electrode material of a battery such as a nickel-hydrogen battery or a nickel-cadmium battery. Celmet is a porous metal object having continuous pores and has a feature that the porosity thereof is higher (90% or more) than those of other porous objects such as metal non-woven fabrics.[0003]Such a porous nickel object is obtained by forming a nickel layer on a surface of a skelet...

Claims

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Application Information

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IPC IPC(8): C25D3/44C25D1/00C25D1/08
CPCC25D3/44C25D1/003C25D1/08C25D3/665C25D5/56
Inventor GOTO, KENGOHOSOE, AKIHISANISHIMURA, JUNICHIOKUNO, KAZUKIKIMURA, KOUTAROUSAKAIDA, HIDEAKIMOTOMURA, JUNICHI
Owner SUMITOMO ELECTRIC IND LTD
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