Weak-alkali electroplating liquid and application thereof

Abstract

The invention discloses weak-alkali electroplating liquid and application thereof. The weak-alkali electroplating liquid comprises basic electroplating liquid and an additive, wherein concentration ofcopper pyrophosphate in the basic electroplating liquid is 50-100 g / L, concentration of potassium pyrophosphate in the basic electroplating liquid is 200-380 g / L, concentration of ammonia water in the basic electroplating liquid is 0.5-8 mL / L, and the pH value of the basic electroplating liquid is adjusted to 7-9 through pyrophosphoric acid; and the additive comprises the following components: abrightener with concentration of 1-20 mL / L in the electroplating liquid and an auxiliary complexing agent with concentration of 1-10 mL / L in the electroplating liquid. The weak-alkali electroplating liquid has the characteristics of current density being 1-10 A / dm < 2 >, electroplating height being 5-150 [mu] m, excellent coating uniformity and the like, does not contain any harmful compound, is green and environment-friendly, is particularly suitable for electronic elements with complex shapes, and can be used for electroplating copper on the electronic elements with diameters being 5-500 [mu] m.

Description

technical field [0001] The present application relates to the technical field of electroplating, in particular to a weak alkali electroplating solution and its application. Background technique [0002] Passive components, also known as passive components, refer to electronic components that do not affect the basic characteristics of the signal, but only allow the signal to pass through without modification. The most common ones are resistors, capacitors, inductors, ceramic oscillators, crystal oscillators, transformers, etc. As global mobile phones enter the era of 4G, 5G multimedia and smart phones, consumer electronics upgrades and new technology applications, as the most basic electronic components, the total demand for passive components has steadily increased. [0003] In particular, with the demand for miniaturization and light weight of downstream terminal products, chip passive components have become a new trend in demand. For example, chip inductors in passive com...

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Problems solved by technology

[0004] Existing electroplating solutions include acidic electroplating solutions and alkaline electroplating solutions, wherein acidic electroplating solutions will corrode magnetic materials in passive components, so acidic electroplating solutions cannot be used; alkaline electroplating solutions mainly refer to pyrophosphate copper plating solutions , using the traditional pyrophosphate copper plating solution can obtain a coating with good adhesion, but the current density can only reach 1-2A / dm when it works 2 , therefore, it can only be used in electroplating processes that do not require much current density, such as thin copper layers, and cannot meet the needs of obtaining thicker coatings.

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