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A high-speed electroplating copper additive and electroplating solution for advanced packaging

A high-speed electroplating, advanced technology, applied in the field of high-speed electroplating copper additives and electroplating solution, can solve the problems of inconsistent height at different positions, poor bump shape, poor uniformity, etc., to avoid voids, avoid coating burnt and rough, and coating Excellent flatness effect

Active Publication Date: 2021-11-12
JIANGSU AISEN SEMICON MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The main purpose of the present invention is to provide a high-speed electroplating copper additive and electroplating solution for advanced packaging, which can effectively solve pitting, roughness, voids, poor uniformity, and poor bump appearance that are prone to occur in advanced packaging Bump / RDL electroplating , Inconsistent heights at different positions and other technical problems

Method used

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  • A high-speed electroplating copper additive and electroplating solution for advanced packaging
  • A high-speed electroplating copper additive and electroplating solution for advanced packaging
  • A high-speed electroplating copper additive and electroplating solution for advanced packaging

Examples

Experimental program
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Effect test

Embodiment 1

[0029] Example 1, Example 2 Parameters As shown in Table 1. Sodium SPS / Wetting PEG-6000 / Of Sodium SPS / Wetting PEG-6000 / Overall Sputter Polyviimide Commonly used in the market additives As the same condition reference group 1, the reference group 2, respectively, electroplated performance test:

[0030] Table 1: Example / Reference Group Parameter Comparison of Electroplating Performance

[0031]

[0032]

[0033] Table 1 Advanced Sealing Electric Plating Copper Plating Performance Evaluation Test Method is as follows:

[0034] 1) Plating ductility test: Apply the oxide anode with titanium, the cathode uses the ground stainless steel plate, electroplating 50-80 microns, 2 h on 120 ° C for 2 hours, and the plating layer is peeled off, and it is produced into 1 cm wide strip, in pull Test the elongation and tensile strength when the plating layer is tested on the promoter. Elimination requirements> 18%, higher, tensile strength requirements 200-500MPa

[0035] 2) Coating ...

Embodiment 2

[0040] Example 2 and the reference group 2 are all copper medium temperature systems in Chinese acid, and the low current density is tested: the normal extension and tensile strength of the plating layer, the uniformity of the plating layer is good, and the appearance of the reference group is basically normal. Point a small amount of empty, the brightness is slightly poor, the plating elongation and tensile strength, uniformity are in the requirement, but it is not as good as in Example 2, and Example 2 is excellent in low current density performance, which can be applied to a small current density of 1.0ASD. .

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PUM

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Abstract

The invention discloses a high-speed electroplating copper additive and electroplating solution for advanced packaging, which comprises copper salt, acid, 20-80ppm of chloride ion, 2-2000ppm of accelerator, 5-5000ppm of carrier agent, and 3-3000ppm of leveling agent ; The copper ion content in the copper salt is 20-90g / L, and the acid content is 0.5-5.0mol / L; the accelerator is a dithiocarbamic acid derivative, and the carrier is EO- PO block copolymer, the leveling agent composition is a composition comprising a copper ion source and at least one leveling agent. The invention can effectively solve the technical problems of defects such as pits, roughness, voids, poor uniformity, poor bump appearance, and inconsistent heights at different positions that are easy to occur in advanced packaging Bump / RDL electroplating.

Description

[Technical field] [0001] The present invention belongs to the field of electroplating deposition, and more particularly to a high-speed electroplated copper additive and an electroplated solution for advanced packaging. 【Background technique】 [0002] Thanks to the superior conductive properties of copper, thermal conductivity and reliability, high-current load carrying capacity, cost savings, etc., copper interconnection technology is widely used in semiconductor manufacturing beol and advanced packaging process. Copper interconnection in the advanced package process is its key process, and is divided into RDL graphic transfer electroplating and BUMP electroplating in accordance with electroplated shape. Compared with the traditional lead bonding process of electroplated copper-plated, the cost of packaging can fall by 20%. In recent years, the advanced packaging technology has developed rapidly, and the application range is gradually expanded. [0003] As the performance requir...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D3/38
CPCC25D3/38
Inventor 胡青华向文胜赵建龙张兵鲍杰朱坤陆兰顾群艳
Owner JIANGSU AISEN SEMICON MATERIAL CO LTD
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