Non-cyanide copper-tin alloy plating solution

Abstract

The invention provides a non-cyanide copper-tin alloy plating solution, wherein the copper-tin alloy plating solution comprises the following main components: stannous pyrophosphate and copper pyrophosphate, potassium pyrophosphate or sodium pyrophosphate as main complexing agent, succimide as auxiliary complexing agent, and soluble dihydric phosphate as buffering agent. The operating conditions of the non-cyanide plating solution are as follows: the pH range is 7.0-9.5; the current density is 0.3-2.5 A / dm2; and the temperature is 20-40 DEG C. The non-cyanide copper-tin alloy plating solutionhas the advantages of being low in cost, simple and convenient for operation and maintenance, and having little toxicity or no toxicity, wide density range of cathode current, high current efficiency, fine and bright plating; and the non-cyanide copper-tin alloy plating solution can satisfy the application requirements in multiple fields such as decoration plating, functional plating and the like.

Description

technical field [0001] The invention relates to a cyanide-free copper-tin alloy electroplating solution. Background technique [0002] With the continuous development of science and technology, the requirements for products are becoming more and more stringent, and the coating of a single element is difficult to meet the needs of electroplating products, so researchers gradually turn their attention to alloy electroplating. In alloy electroplating, the copper-tin alloy coating has the advantages of excellent corrosion resistance and oxidation resistance, and can be widely used in decorative coatings such as silver substitutes. At the same time, because the copper-tin alloy can effectively prevent the base metal atoms from diffusing into the coating The surface, thus avoiding causing discoloration, is applied instead of the nickel layer (direct contact with metallic nickel can cause nickel sensitivity symptoms in human skin). So far, the copper-tin alloy plating process at h...

AI Technical Summary

Problems solved by technology

[0004] These cyanide-free copper-tin alloy plating solutions have the following disadvantages compared with cyanide plating solutions: (1) low current density (0.5 A / dm2 ~1.0A / dm2); (2) The plating solution is unstable; this is because Sn (II) is easily oxidized, and Sn (IV) is easily hydrolyzed to form an insoluble acid Alkali β-stannate; (3) The cost is relatively high; this is due to the complex configuration methods of many cyanide-free copper-tin alloy plating solutions, and the use of more complexing agents or auxiliary complexing agents, resulting in complex solution components