High efficiency thermal conductivity structure

Abstract

A high efficiency thermal conductivity structure includes a substrate, and plural thermally conductive wires formed on both surfaces of the substrate. The substrate is capable of forming the thermally conductive wires made of a high thermal conductivity material by a physical or chemical method. The thermally conductive wire includes a carbon nanotube or a tubular or columnar material with high thermal conductivity. The thermally conductive wire has a diameter or cross section in microscale or nanoscale size, a length in nanoscale to millimeter-scale size. During use, the thermal conductivity structure is placed between a heat source and a cooling unit. Heat from a heat source is conducted through the thermally conductive wire to the substrate. After the heat at the substrate re-adjusts its heat conduction path, the heat can be conducted from the thermally conductive wire on the other surface to the cooling unit efficiently.

Description

FIELD OF THE INVENTION[0001]The present invention relates to a high efficiency thermal conductivity structure, and more particularly to the thermal conductivity structure having a sheet substrate, a plurality of thermally conductive wires formed on both surfaces of the substrate respectively, and the thermal conductivity structure of the invention is placed between a heat source and a cooling unit during use; and the heat of a heat source is conducted through the thermally conductive wires to the sheet substrate, and after the heat at the substrate adjusts its heat conduction path, the heat can be conducted from the thermally conductive wire on the other surface to the cooling unit more efficiently, and the thermal conductivity structure of the present invention is flexible and may be applied to a surface with different flatness and curvature.BACKGROUND OF THE INVENTION[0002]Cooling is one of the mainstream technologies. Various types of equipments convert energy of different forms ...

AI Technical Summary

Benefits of technology

The present invention provides a thermal conductivity structure that efficiently conducts heat from a hot source to a cooling unit. The structure is flexible, can be applied to uneven surfaces, and is simple and easy to manufacture. The thermally conductive wires are arranged independently and are not covered by adhesive, which improves the thermal conduction path and ensures efficient heat transfer. The production process of the thermal conductivity structure is feasible and low-cost, as no further rearrangement is required or linking agent is needed.

Problems solved by technology

Various types of equipments convert energy of different forms into heat during their operation, and an increase of heat quantity and temperature may affect the performance of the operation of the equipment or even may give rise to a risk of burning or damaging the equipment, so that an electric appliance is generally equipped with a cooling device for dissipating heat and maintaining a normal operation of the electric appliance.

These gaps have air of a very low thermal conductive coefficient (0.024W / m-k), and thus result in a poor thermal conduction effect.

However, the thermal paste is usually composed of a main ingredient of a high thermal conductivity coefficient such as a mixture of metal particles, graphite, carbon tube, diamond, and linking agents, but these linking agents have a thermal conductivity coefficient much lower than that of the material of the cooling unit (such as aluminum with the thermal conductivity coefficient of 237W / m-k), and the linking agents are covered onto the main ingredient of the high thermal conductivity coefficient and thus fail to conduct the heat of the heat source through the main ingredient of the high thermal conductivity coefficient to the cooling unit directly, and the thermal conduction is interfered and affected by the linking agents of the low conductivity coefficient.

As a result, the overall thermal conductivity efficiency cannot be improved effectively.

Since the volume of the cooling unit is not too small, and the shape of the cooling unit is relatively complicated, this manufacturing method is not simple, and the transportation of the product occupies much space and requires protection.

However, the arrangement of carbon nanotubes is not easy, and the gaps between the carbon tubes are very small, and it is very difficult, if not impossible, to fill a linking agent with high viscosity into the gaps between the carbon nanotubes.

However, the thermos-conductive efficient of Alumina is low and its strength is weak.

Furthermore, the heat is conducted by the copper wires and not by the AAO module board so that the ability for thermos reforming is low and cannot evenly conduct the heat.

Besides, the processes for manufacturing is complicated, because the copper has to be deposited in the holes of the module board, and the module board is dissolved by the solution liquid so as to expose the copper wires.

The copper cannot be properly deposited if the holes is too deep.

Therefore, the yield rate decreases and cannot proceed large-area production.

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