Supporting glass substrate, laminate, semiconductor package, electronic device, and method of manufacturing semiconductor package

a technology of supporting glass substrate and semiconductor package, which is applied in the direction of manufacturing tools, lapping machines, other domestic articles, etc., can solve the problems of difficult to increase the number of pins, high-density mounting of semiconductor chips, and strict mounting space for semiconductor chips to be used in those electronic devices, so as to reduce the variation of total thickness, the processing substrate is supported more accurately, and the effect of strong and accurate suppor
US20180226311A1Inactive Publication Date: 2018-08-09NIPPON ELECTRIC GLASS CO LTD
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Patent Information

Authority / Receiving Office
US · United States
Current Assignee / Owner
NIPPON ELECTRIC GLASS CO LTD
Publication Date
2018-08-09
Estimated Expiration
Not applicable · inactive patent

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Abstract

Devised are a supporting substrate capable of contributing to an increase in density of a semiconductor package and a laminate using the supporting substrate. A supporting glass substrate of the present invention includes a polished surface on a surface thereof and has a total thickness variation of less than 2.0 μm.
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Description

TECHNICAL FIELD

[0001] The present invention relates to a supporting glass substrate and a laminate using the supporting glass substrate, and more specifically, to a supporting glass substrate to be used for supporting a processed substrate in a manufacturing process for a semiconductor package and a laminate using the supporting glass substrate.BACKGROUND ART

[0002] Portable electronic devices, e.g., a cellular phone, a notebook-size personal computer, and a personal data assistance (PDA), are required to be downsized and reduced in weight. Along with this, a mounting space for semiconductor chips to be used in those electronic devices is strictly limited, and there is a problem of high-density mounting of the semiconductor chips. In view of this, in recent years, there has been an attempt to perform high-density mounting of a semiconductor package by a three-dimensional mounting technology, that is, by laminating semiconductor chips on top of another and connecting the semiconductor c...

Claims

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