Liquid crystal display device and method for manufacturing the same

Abstract

An LCD device having improved connection stability concerning a COG, a COF or an FPC and a method for manufacturing the LCD device are disclosed. A pixel including a TFT as a switching device is formed at a central portion corresponding to an active region of a substrate. A gate and a data input pads are formed at a peripheral portion corresponding to a pad region of a substrate. An organic insulation layer is formed on the whole surface of the substrate having the TFT the pads thereon. A rugged structure is formed on the organic insulation layer for forming a rugged reflection electrode by exposing and developing the organic insulation layer. An organic insulation layer is formed to reduce a step between the pads and the portion adjacent to the pads. A single organic insulation layer or double organic insulation layers can be formed. A connection failure between the pads and the COG, the COF or the FPC can be greatly reduced since the height difference of the organic insulation layer between the pads the portion adjacent to the pads can be minimized through the exposing and the developing processes. Also, an electrical short between the pads can be prevented because the organic insulation layer is interposed between the pads.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to a method for a liquid crystal display device (LCD) and a method for manufacturing the same, more particularly to an LCD device having enhanced connection stability between a driving circuit of the LCD device and chip on glass (COG), a chip on film (COF) or a flexible printed circuit film (FPC) and a method for manufacturing the same.[0003]2. Description of the Related Art[0004]In the information society of the present time, electronic display devices are more important as information transmission media and various electronic display devices are widely applied for industrial apparatus or home appliances. Such electronic display devices are being continuously improved to have new appropriate functions for various demands of the information society.[0005]In general, electronic display devices display and transmit various pieces of information to users who utilize such information. That is, ...

AI Technical Summary

Benefits of technology

[0042]According to the present invention, it can be minimized that the difference in height between one portion of the organic insulation layer in the pad region and the other portion of the organic insulation layer adjacent to the pad region by exposing and developing single organic insulation layer or double organic insulation layers. Therefore, the connection failure between the pads of the LCD device and the COG, the COF, the FPC can be greatly decreased when the COG, the COF, the FPC is compressed to the pads of the LCD device. Also, the electrical short between the pads of the LCD device can be prevented since the organic insulation layer remains between the pads while the step between the pads is greatly decreased. Furthermore, the step in the pad region can be minimized without performing another process for reducing the step since it is reduced that the height difference between the height difference between one portion of the organic insulation layer in the pad region and the other portion of the organic insulation layer adjacent to the pad region when the organic insulation layer is exposed and developed so as to from the contact hole and the reflection electrode.

Problems solved by technology

The CRT, however, has some disadvantages such as a heavy weight, a large volume and high power dissipation.

In the conventional method for manufacturing the LCD device, however, since the organic insulation layer or a layer having thick thickness is formed on the TFT as a protection layer, the connection failure between an external device and the LCD device may occur due to the step between the pad region having the metal formed thereunder and the peripheral region when the external device such as the COG, the COF or the FPC is connected to the pad region of the LCD device.

Thus, the LCD device module may not operate or operate improperly due to the connection failure.

In particular, the connection failure between the COG and the pad may be increased since the COG is connected to the pad by using the conductive ball with a diameter of about 5 μm during the conventional compression process.

Also, electrical shorts between adjacent pads become more likely may be increased when the organic insulation layer formed on the pads and the peripheral region is removed because the organic insulation layer prevents the electrical short between the adjacent pads among a plurality of pads, whereby reducing the reliability of the product.

Images