The invention relates to the technical field of
chip heat dissipation, in particular to a
chip double-sided liquid cooling heat dissipation
system which comprises a fixing mechanism, a
chip and a substrate, the two sides of the chip are symmetrically, evenly and fixedly connected with a plurality of pins, and the chip is electrically connected with the substrate through the pins on the two sides. According to the invention, by simultaneously carrying out liquid cooling heat dissipation on the two surfaces of the chip, heat generated by the chip can be quickly and effectively removed, the heat dissipation requirement of the high-power-consumption chip is met, the chip is ensured to work in a stable temperature environment, the problem of heat dissipation of the high-power and multi-module chip is effectively solved, and the service life of the chip is prolonged. A large
temperature difference caused by uneven heat dissipation of the upper surface and the lower surface of the chip is avoided, the overall temperature distribution of the chip is more uniform, stable performance of the chip is facilitated, the liquid leakage condition of the device is detected in real time through the liquid leakage
detector, a liquid leakage
signal is processed and then transmitted to the audible and visual alarm, and the device is convenient to use. And the audible and visual alarm sends out an audible and visual
alarm signal, so that the use safety of the device is improved.