Unlock instant, AI-driven research and patent intelligence for your innovation.

Resin composition, cured resin, sheet-like cured resin, laminated body, prepreg, electronic parts and multilayer boards

A technology for multi-layer substrates and electronic devices, applied in the direction of electric solid devices, semiconductor devices, electrical components, etc., can solve the problems of heat resistance, low dielectric loss tangent, high dielectric constant, etc., and achieve vitrification. Effects of increased transition temperature and decomposition start point temperature, increased glass transition temperature, and excellent adhesion

Inactive Publication Date: 2007-11-14
TDK CORPARATION
View PDF9 Cites 7 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] As for materials with high dielectric constants, polyvinylidene fluoride, trifluoroethylene-tetrafluoroethylene copolymers, polymers containing cyano groups, etc. are generally known, but in terms of frequency characteristics, low dielectric loss tangent , There are problems in heat resistance, and it cannot be said that it is suitable for use as an insulating material constituting electronic devices
[0013] In addition, thermoplastic resins such as polyolefins, vinyl chloride resins, fluororesins, syndiotactic polystyrene, aromatic polyester resins, unsaturated polyester resins, polyester resins, etc. Imide resin, epoxy resin, bismaleimide triazine resin (BT resin), cross-linkable polyphenylene ether, curable polyphenylene ether, polyvinyl benzyl ether resin, benzocyclobutene resin However, as mentioned above, these resins not only cannot be used for radio waves in the high-frequency field, but also cannot fully satisfy heat resistance, film processability, chemical resistance, insulation, and low dielectric loss angle. In addition, it is difficult to achieve high dielectric constant and low dielectric loss tangent only by using the above-mentioned resins.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Resin composition, cured resin, sheet-like cured resin, laminated body, prepreg, electronic parts and multilayer boards
  • Resin composition, cured resin, sheet-like cured resin, laminated body, prepreg, electronic parts and multilayer boards
  • Resin composition, cured resin, sheet-like cured resin, laminated body, prepreg, electronic parts and multilayer boards

Examples

Experimental program
Comparison scheme
Effect test

no. 1 Embodiment approach

[0325] 1G is a perspective perspective view showing an inductor according to the first embodiment of the electronic device of the present invention, and FIG. 2 is a cross-sectional view showing the inductor according to the first embodiment of the electronic device of the present invention.

[0326] In Fig. 1G and Fig. 2, the inductor 10 includes: a laminated body in which the constituent layers 10a to 10e are laminated, internal conductors 13a to 13d provided on the constituent layers 10b to 10e, and internal conductors 13a to 13d for electrically connecting the constituent layers 10a to 10e. 13d through hole 14. In addition, a coil pattern (conductive element portion) is formed by the inner conductor 13 and the via hole 14 .

[0327] Each of the constituent layers 10a to 10e is composed of the composite dielectric layer described above. The through hole 14 may be formed by a drill, laser processing, etching, or the like.

[0328] In addition, terminal electrodes 12 are res...

no. 2 Embodiment approach

[0334] 3 is a perspective perspective view showing an inductor according to a second embodiment of the electronic device of the present invention, and FIG. 4 is a cross-sectional view showing the inductor according to the second embodiment of the electronic device.

[0335] The electronic device of this embodiment differs from the electronic device of the first embodiment in that the coil pattern is wound back in the lateral direction, that is, in the direction connecting the opposing terminal electrodes 12 .

[0336] The other components are the same as those of the first embodiment, and in FIGS. 3 and 4 , the same symbols are assigned to the same components, and description thereof will be omitted.

no. 3 Embodiment approach

[0338] 5 is a perspective perspective view showing an inductor according to a third embodiment of the electronic device of the present invention, and FIG. 6 is a cross-sectional view showing the inductor according to the third embodiment of the electronic device according to the present invention.

[0339] The electronic device of the present embodiment differs from the electronic device of the first embodiment in that the upper and lower inner conductors 13 formed in a spiral shape are connected to each other through the via hole 14 .

[0340] The other components are the same as those of the first embodiment, and in FIGS. 5 and 6 , the same symbols are assigned to the same components, and explanations thereof are omitted.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
peel strengthaaaaaaaaaa
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
Login to View More

Abstract

PROBLEM TO BE SOLVED: To provide a prepreg providing a cured product having a high glass transition temperature, and exhibiting a high dielectric constant and a low dielectric loss tangent in a giga Hz frequency region.SOLUTION: The prepreg is obtained by semi-curing a resin composition comprising a curable mixture comprising an active ester compound and an epoxy resin, and a dielectric ceramic powder and a reinforcing fiber, compounded with the curable mixture. The active ester compound is obtained by reacting a compound having a phenolic hydroxy group, with a compound having two or more groups forming ester bonds by reacting with the phenolic hydroxy groups.

Description

technical field [0001] The present invention relates to resin compositions, cured resins, sheet-shaped cured resins, laminates, prepregs, electronic devices, and multilayer substrates, and more specifically, to resin compositions and cured resins useful in the high-frequency field of 100 Mz or higher , flaky cured resins, laminates, prepregs, electronic devices, and multilayer substrates. Background technique [0002] In recent years, along with the rapid increase of communication information, there has been a strong desire for miniaturization and weight reduction of communication equipment, and accordingly there has been a desire for miniaturization and weight reduction of electronic devices. On the other hand, portable mobile communications and satellite communications use radio waves in the high-frequency range of the gigahertz band. [0003] In order to cope with radio waves in the above-mentioned high-frequency range, it is required that the energy loss or transmission...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08J5/24B32B15/08B32B15/092C08K3/22C08K5/105
CPCH01L2224/48091H01L2224/73265H01L2224/48227H01L2924/19105H01L2924/19041H01L2924/181H01L2924/00014H01L2924/00012
Inventor 高谷稔远藤敏一川畑贤一
Owner TDK CORPARATION