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Sheet solid electrolytic condensor with small size and simple structure

A solid electrolyte, capacitor technology, applied in solid electrolytic capacitors, electrolytic capacitors, capacitors and other directions, can solve the problems of low volume efficiency and decline

Inactive Publication Date: 2008-12-17
TOKIN CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the volume ratio of the anode terminal and the cathode terminal increases, the ratio of the volume of a part of the capacitive element that affects the capacitance to the total volume of the capacitor, that is, the volumetric efficiency, decreases
For example, when the thickness (height) of the capacitor (encapsulation resin) is 0.8 mm, the volumetric efficiency of the capacitive element may be as low as 20% or less

Method used

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  • Sheet solid electrolytic condensor with small size and simple structure
  • Sheet solid electrolytic condensor with small size and simple structure
  • Sheet solid electrolytic condensor with small size and simple structure

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0068] First, a method of manufacturing the capacitive element 11 will be described below.

[0069] Tantalum (Ta) is used as a valve metal. Tantalum powder was formed on a tantalum wire as anode lead 12a using a punching machine. The tantalum wire is sintered in a high vacuum and high temperature environment. In the present invention, the valve metal appears as a metal that forms an oxide film when oxidized, and the oxide film functions as a valve.

[0070] Thereafter, an oxide film Ta205 is formed on the tantalum powder of the sintered tantalum wire.

[0071] Next, after this tantalum sintered body is immersed in manganese nitrate liquid, MnO2 is produced by pyrolysis of this immersed body.

[0072] Thereafter, graphite and silver cathode surfaces 12b were formed on this impregnated body.

[0073] Thus, the capacitive element 11 is produced.

[0074] second reference 5A to 5D , the formation of the lead frame 40 will be described.

[0075] like Figure 5A As shown, a...

no. 2 example

[0084] In the second embodiment of the present invention, as Figure 6B The protrusions 51 shown are formed on the anode terminal forming portion 43 . The anode lead 12 a is in contact with the side surface of the protruding portion 51 . The anode lead 12a and the protrusions 51 are irradiated with a laser beam. The protrusions 51 are melted and react with the peripheral surface of the anode lead 12a. Thus, the welded portion is formed.

[0085] Other fabrication steps in the second embodiment are the same as those in the first embodiment. In the second embodiment, the metal formation of the anode terminal forming portion is slightly easier than in the first embodiment.

no. 3 example

[0087] Referring to FIG. 10A , in the third embodiment of the present invention, wedge-shaped concave portions 142 are formed on the left and right sides 141 of the exposed surface of the anode terminal forming portion 43 (cathode terminal forming portion 44 ) which is exposed from the first The package end surface 19a (second package end surface 19b) is exposed. In this structure, the encapsulation resin 13 enters the wedge-shaped concave portion 142, so that the adhesive strength of the encapsulation resin 13 to the anode terminal forming portion 43 (cathode terminal forming portion 44) is improved.

[0088] The formation of the wedge-shaped concave portion 142 is completed in the same step as the thinning of the anode terminal forming portion 43 (cathode terminal forming portion 44 ) or the formation of the protruding portion 51 .

[0089] Other manufacturing steps in the third embodiment are the same as those in the first or second embodiment.

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Abstract

In a chip type solid electrolytic capacitor, a capacitive element and an encapsulating resin covering the capacitive element are included, the encapsulating resin has a mounting surface and side surfaces adjoining the mounting surface. A terminal is electrically connected to the capacitive element and combined with the encapsulation resin, the terminal extends along the mounting surface and the side surface to have an outer surface exposed from the encapsulation resin and an inner surface opposite to the terminal outer surface. The inner surface has a stepped shape formed by forging.

Description

[0001] This application claims priority from the previous Japanese application JP 2003-16177, the disclosure of which is incorporated herein by reference. technical field [0002] The present invention relates to a one-piece solid electrolytic capacitor and a manufacturing method thereof. Background technique [0003] An example of a one-piece solid electrolytic capacitor includes a capacitive element, an encapsulating resin covering the capacitive element, and anode terminals and cathode terminals electrically connected to the capacitive element and bonded to the encapsulating resin. The encapsulating resin has a mounting surface and a side surface adjacent to the mounting surface. A chip-type solid electrolytic capacitor of this form is disclosed in Japanese Unexamined Patent Application Publication No. 291079 / 1993 and will be described in detail in connection with the accompanying drawings. [0004] In an attempt to reduce the size and height of such a chip-type solid el...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01G9/012H01G9/15H01G9/08H01G9/00H01G9/042H01G9/10H01L21/44H01L23/28
CPCH01G9/012H01G9/042H01G9/10H01L2924/0002Y10S257/924Y10T29/435Y10T29/4913H01L2924/00E04G11/50
Inventor 佐野光范向野节筒井诚
Owner TOKIN CORP