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Cleaning-free soldering flux and its preparation method

A flux and no-cleaning technology, applied in the field of welding materials and flux, can solve the problems of low solid content, low solderability, high corrosion, etc., and achieve the effect of good wettability and qualified dryness

Inactive Publication Date: 2009-06-03
天津市瑞坚新材料科贸有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the consideration of soldering activity, the traditional soldering flux has a high solid content and contains halogens. After soldering, there are residues on the PCB surface that are not easy to clean. It is highly corrosive, has a high degree of ion pollution, and has low surface insulation resistivity.
With the development and demand of electronic soldering technology, a no-cleaning flux has been developed, which is generally composed of rosin, activator, and organic solvent. It is characterized by low solid content, less residue after welding, non-corrosive, and low ion pollution. Low surface insulation resistivity
However, the no-cleaning flux in the prior art has low solderability, and the rosin is prone to crystallization due to the fast solvent volatilization after welding, so that the effect of no-cleaning cannot be achieved.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] Succinic acid 3g

[0024] Adipic acid 3g

[0025] Malic acid 3g

[0026] Alkylphenol ethoxylates 1g

[0027] Rosin methyl ester 1g

[0028] Hydrogenated modified rosin 9g

[0029] Terpineol 30g

[0030] Isopropanol 400g

[0031] Absolute ethanol 550g

[0032] 1. Add succinic acid, adipic acid, malic acid, alkylphenol polyoxyethylene ether, rosin methyl ester, hydrogenated modified rosin, terpineol, isopropanol, and absolute ethanol to the reactor by weight middle;

[0033] 2. Stir in the reaction kettle for 2-3 hours to fully dissolve the raw materials;

[0034] 3. Stand in the reaction kettle for half an hour to make the undissolved part precipitate;

[0035] 4. The resulting liquid is filtered;

[0036] 5. Packaging.

Embodiment 2

[0038] Succinic acid 5g

[0039] Adipic acid 5g

[0040] Malic acid 5g

[0041] Alkylphenol ethoxylates 1g

[0042] Rosin methyl ester 1g

[0043] Hydrogenated modified rosin 8g

[0044] Terpineol 50g

[0045] Isopropanol 475g

[0046] Absolute ethanol 450g

[0047] 1. Add succinic acid, adipic acid, malic acid, alkylphenol polyoxyethylene ether, rosin methyl ester, hydrogenated modified rosin, terpineol, isopropanol, and absolute ethanol to the reactor by weight middle;

[0048] 2. Stir in the reaction kettle for 2-3 hours to fully dissolve the raw materials;

[0049] 3. Stand in the reaction kettle for half an hour to make the undissolved part precipitate;

[0050] 4. The resulting liquid is filtered;

[0051] 5. Packaging.

Embodiment 3

[0053] Succinic acid 10g

[0054] Adipic acid 10g

[0055] Malic acid 10g

[0056] Alkylphenol polyoxyethylene ether 0.5g

[0057] Rosin methyl ester 1.5g

[0058] Hydrogenated modified rosin 10g

[0059] Terpineol 30g

[0060] Isopropanol 450g

[0061] Absolute ethanol 478g

[0062] 1. Add succinic acid, adipic acid, malic acid, alkylphenol polyoxyethylene ether, rosin methyl ester, hydrogenated modified rosin, terpineol, isopropanol, and absolute ethanol to the reactor by weight middle;

[0063] 2. Stir in the reaction kettle for 2-3 hours to fully dissolve the raw materials;

[0064] 3. Stand in the reaction kettle for half an hour to make the undissolved part precipitate;

[0065] 4. The resulting liquid is filtered;

[0066] 5. Packaging.

[0067] According to the national standard GB9491 test standard, the expansion rate is 87%, and the insulation resistance after welding is 4.3×10 11 Ω, the solid content is 2.4%, and the ion pollution degree is 0.3NaCl μg / cm...

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PUM

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Abstract

The invention relates to the soldering flux. The cleaning free solder flux comprises amber acid 0. 3-1%, adipic acid 0. 3-1%, malic acid 0. -1%, polyoxyethylated alkyl phenol 0. 05-0. 1%, abietyl resin 0. 1-0. 2%, hydrogenation abietyl 0. 8-1%, terpineol 3-5%, alcohol isopropylicum 40-47. 5%, with the rest being water free alcohol. It is transparent, free from pungent odor, clean in PCB surface, free from cleaning, fine in moisture, expansion rate bigger than 85%, soldered insulator resistance bigger than 4X1011Omega, fixed content less than 2. 5%, ion pollution degree less than 0. 3NaCl mug / cm2 with qualified corrosion and dryness.

Description

technical field [0001] The invention belongs to the field of welding materials; in particular, the field of flux. Background technique [0002] As a common auxiliary material for soldering technology, flux is widely used in the field of electronic and electrical PCB welding. Due to the consideration of soldering activity, the traditional flux has a high solid content and contains halogens. After soldering, there are residues on the PCB surface that are not easy to clean, are highly corrosive, have a high degree of ion pollution, and have low surface insulation resistivity. With the development and demand of electronic soldering technology, a no-cleaning flux has been developed, which is generally composed of rosin, activator, and organic solvent. It is characterized by low solid content, less residue after welding, non-corrosive, and low ion pollution. The surface insulation resistivity is low. However, the no-cleaning flux in the prior art has low solderability, and the r...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/362
Inventor 张凤兰宋红石岳涛
Owner 天津市瑞坚新材料科贸有限公司
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