Sheet type ferrite inductor terminal electrode and its preparation method

An inductor and ferrite technology, applied in the field of chip ceramic electronic components, can solve the problems of complex process and cumbersome process, and achieve the effect of simplifying the production process, reducing the production cost and saving precious metal resources.

Inactive Publication Date: 2009-12-30
UNIV OF SCI & TECH BEIJING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The preparation of terminal electrodes requires the use of two different technologies, high-temperature sintering and electroplating, and the investment and use of two different sets of equipment, the process is cumbersome and the process is complicated

Method used

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  • Sheet type ferrite inductor terminal electrode and its preparation method
  • Sheet type ferrite inductor terminal electrode and its preparation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0012] Select 100 pieces of sintered nickel-copper-zinc ferrite chip multilayer inductor (MLCI) blanks, the size is 0402 (0.04 inches × 0.02 inches), and the ferrite composition is Ni 0.3 Zn 0.5 Cu 0.2 Fe 2 o 4 , the molar percentage of iron element is 28.6%. Put the chip inductor and the steel ball with a diameter of 0.5mm in the hanging basket, immerse the hanging basket in the sodium sulfate aqueous solution, use the titanium basket as the anode, electrolyze the aqueous solution under vibration conditions, and perform electrochemical atomic hydrogen on the chip inductor. Conductivity modification treatment to prepare the self-body electrode of the chip inductor. The process parameters are as follows:

[0013] Sodium Sulfate (Na 2 SO 4 ) aqueous solution 50 g / L

[0014] Cathode current density 2 amps / square decimeter

[0015] temperature room temperature

[0016] After 0.5 hours, take out the hanging basket, clean the hanging basket, chip inductors and steel balls ...

Embodiment 2

[0033] Select 100 sintered planar hexagonal Co2Z ferrite chip inductor blanks, the size is 0603 (0.06 inches × 0.03 inches), and the ferrite composition is Ba 3 co 2 Fe 24 o 41 , the molar percentage of iron element is 34.3%. Put the chip inductor and the steel ball with a diameter of 1mm in the hanging basket, immerse the hanging basket in the sodium sulfate aqueous solution, use the titanium basket as the anode, electrolyze the aqueous solution under vibration conditions, and perform electrochemical atomic hydrogen conductance on the chip inductor. Modification treatment to prepare the self-body electrode of the chip inductor. The process parameters are as follows:

[0034] Sodium Sulfate (Na 2 SO 4 ) aqueous solution 200 g / l

[0035] Cathode current density 0.5 ampere / square decimeter

[0036] Temperature 50°C

[0037] After 0.5 hours, take out the hanging basket, clean the hanging basket, chip inductors and steel balls with deionized water, then place the hanging ...

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Abstract

A terminal electrode for chip ferrite inductors and a preparation method thereof are provided, which belongs to the technical field of chip ceramic electronic components. The terminal electrode for chip ferrite inductors has a two-layered structure and is prepared by firstly forming an autologous electrode on the terminal surface of a chip ferrite inductor to increase the surface electronic conductivity of the terminal ferrite of the chip ferrite inductor, to reduce the resistivity less than 10<4> Ohm*m and to allow the ferrite on the terminal surface semi-conductive even metallized; then electroplating Ni on the autologous electrode as a conductive seed layer to form a metal Ni layer; and finally electroplating Sn or Sn-Pb alloy on the Ni layer to obtain a Ni / Sn or Sn-Pb two-layered electrode. The invention has the advantages of no use of precious metal paste in the prior preparation process of terminal electrode in chip ferrite inductor, reduced production cost, reduced consumption of precious metals, and simplified production process.

Description

technical field [0001] The invention belongs to the technical field of chip ceramic electronic components, in particular to a terminal electrode of a chip ferrite inductor and a preparation method thereof. Background technique [0002] The terminal electrode preparation of chip ceramic electronic components is now generally using three-layer electrode technology, that is, firstly use a coating machine to dip precious metal paste, such as silver paste, on both ends of the chip ceramic component body, and then sinter it at high temperature. Form the bottom electrode, then electroplate one layer of nickel layer as a barrier layer, and finally electroplate a layer of tin or tin-lead alloy layer as a solderable layer, that is, form a three-layer electrode structure of silver / nickel / tin or tin-lead [D.A.Bem, C.J. Feltz, R. Haynes, and S.C. Pinault, Statistical Determination of Plating Process Variables for Multilayer Ceramic Chip Capacitors, Journal of the American Ceramic Society...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01F27/29C04B35/26C04B35/622
Inventor 曹江利
Owner UNIV OF SCI & TECH BEIJING
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