Method of preparing tin-copper-nickel-cobalt alloy cathode material by two-step plating
A negative electrode material, nickel-cobalt alloy technology, applied in the field of thin-film lithium-ion batteries, can solve the problems of large irreversible capacity, large volume expansion rate, and large capacity attenuation, and achieve excellent discharge performance, simple preparation process, and low raw material cost. Effect
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Embodiment 1
[0020] (1) Modified layer electroplating and preparation of electroplating solution
[0021] Dissolve 50g of nickel chloride, 180g of cobalt chloride and 1g of boric acid in 900mL of distilled water according to the weight to volume ratio, and control the temperature of the electroplating solution to 20°C.
[0022] Place the copper sheet in the electroplating solution at 0.1A / dm 2 Under the direct current of 30 minutes in cathodic electroplating, obtain the copper sheet that coats nickel-cobalt alloy film layer.
[0023] (2) Preparation of activation layer electroplating and electroplating solution
[0024] Dissolve 5g of sodium stannate, 5g of sodium hydroxide and 5g of sodium acetate in 800mL of distilled water according to the ratio of weight to volume, and control the temperature of the electroplating solution to 40°C.
[0025] Clean the copper sheet coated with the nickel-cobalt alloy film layer and place it in the activation plating solution at 0.1A / dm 2 Under the dir...
Embodiment 2
[0027] (1) Modified layer electroplating and preparation of electroplating solution
[0028] Dissolve 280g of nickel chloride, 10g of cobalt chloride and 10g of boric acid in 900mL of distilled water according to the weight to volume ratio, and control the temperature of the electroplating solution to 40°C.
[0029] Place the copper sheet in the plating solution at 0.5A / dm 2 Under the direct current of 5 minutes, the copper sheet coated with the nickel-cobalt alloy film layer was obtained by cathodic electroplating for 5 minutes.
[0030] (2) Preparation of activation layer electroplating and electroplating solution
[0031] Dissolve 30g of sodium stannate, 30g of sodium hydroxide and 20g of sodium acetate in 900mL of distilled water by weight to volume ratio, and control the temperature of the electroplating solution to 60°C.
[0032] Clean the copper sheet covered with the nickel-cobalt alloy film layer and place it in the activation layer plating solution at a current den...
Embodiment 3
[0034] (1) Modified layer electroplating and preparation of electroplating solution (weight to volume ratio)
[0035] Dissolve 140g of nickel chloride, 90g of cobalt chloride and 30g of boric acid in 900mL of distilled water according to the weight to volume ratio, and control the temperature of the electroplating solution to 75°C
[0036] Place the copper sheet in the plating solution at 1.5A / dm 2 Under the direct current of 0.2 minutes, the copper sheet coated with the nickel-cobalt alloy film layer was obtained by cathodic electroplating for 0.2 minutes.
[0037] (2) Preparation of activation layer electroplating and electroplating solution
[0038] Dissolve 60g of sodium stannate, 50g of sodium hydroxide and 30g of sodium acetate in 800mL of distilled water according to the weight to volume ratio, and control the temperature of the plating solution to 60°C.
[0039] Clean the copper sheet coated with the nickel-cobalt alloy film layer and place it in the electroplating sol...
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