Full refraction projection optical system

Abstract

This invention provides one total reflection projection optical system for object plane to form imaging plane, wherein the said system is divided into front and back sets to form hole diaphragm as symmetric surfaces; the front set comprises first to sixth lens with one to three lens form reverse distant structure; the back set orderly comprises seven to twelve lens symmetric to six to one lens about hole radium; the said whole reflection projection optical system all surface types are of sphere or plane without non-sphere surface.

Description

technical field [0001] The invention relates to a projection optical system, in particular to a total refraction projection optical system used for semiconductor photolithography and photographic plate making. Background technique [0002] With the development of projection lithography technology, the performance of projection optical system is gradually improved, and can be applied to various fields such as integrated circuit manufacturing. Projection lithography technology has been successfully applied to the field of submicron resolution integrated circuit manufacturing. In semiconductor packaging technology, projection lithography technology can be used for gold bumps / tin bumps that require lower resolution (such as a few microns), larger depth of focus, and higher yields, and silicon wafer-level chip-scale packaging (WLCSP) technology and other fields. [0003] However, in the prior art, such as U.S. Patent No. 6,879,383 (announcement date: April 12, 2005), it adopts ...

AI Technical Summary

Problems solved by technology

The patent gives the data of the objective lens and the imaging quality, but the aberration cannot meet the requirements of the bumping lithography technology at all, and there are two glued surfaces that do not meet the requirements of the lithography technology.

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