Gold plating liquid and gold plating method

A technology of gold plating solution and gold ions, applied in the direction of electrodes, etc., can solve the problems that the gold coating is difficult to use for decoration and electronic components, reduce the gloss and smoothness of the gold coating, and the gold grains of the gold coating are coarse, and achieve excellent surface smoothness. Excellent chemical stability, dense and fine gold grains

Inactive Publication Date: 2007-10-31
MITSUBISHI CHEM CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] 1) The working environment and waste liquid treatment problems caused by toxic substances;
[0011] 2) has low chemical stability due to being easily oxidized etc.; and
[0012] 3) The gold grains of the gold coating are coarse
[0013] In particular, when the gold crystal grains of the gold plating film are coarse, the gloss and smoothness of the gold plating film are reduced, and as a result, the gold plating film is difficult to be used for decoration and electronic components

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0100] Into a three-necked flask equipped with a stirrer, 10 g of gold, 40 g of potassium iodide, 8 g of iodine, 392 g of water, and 550 g of diethylene glycol were charged, followed by stirring and mixing at 70°C. After stirring for 16 hours, the gold was completely dissolved. By using the gold plating solution obtained, gold is used as the counter electrode (anode), and when the gold sputtering film (cathode) is 4mA / cm 2 When the plating operation was performed at a current density of 90 minutes, the plating operation was performed at a voltage of about 0.1V.

[0101] The elemental distribution of the obtained plated film and the underlying sputtered film was analyzed along the depth direction by Auger electron spectroscopy, and it was confirmed that the plated film is a film whose main component is gold.

[0102] In this example, the time required to form the entire gold film including the plated film and the underlayer was about three times longer than the time required t...

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PUM

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Abstract

Disclosed is a gold plating liquid and a method for gold plating, wherein the gold plating liquid containing iodine and / or iodide ions, gold ions and a polyhydric alcohol having 4 or more carbon atoms. This gold plating liquid is stable and low in toxicity, while achieving performance comparable to cyan-type gold plating liquids. The polyhydric alcohol having 4 or more carbon atoms may be diethylene glycol or triethylene glycol. The amount of the polyhydric alcohol having 4 or more carbon atoms contained in the gold plating liquid is usually 10-90% by weight. The gold plating liquid may contain water.

Description

technical field [0001] The invention relates to a gold-plating solution and a gold-plating method, more particularly to a non-cyanide electrolytic gold-plating solution and an electrolytic gold-plating method using the gold-plating solution. Background technique [0002] As a gold plating solution, a cyanide-based gold plating solution has long been known. When using a cyanide-based gold plating solution, a dense gold plating film with excellent surface smoothness can be deposited. Because cyanide gold plating solution is stable and easy to control, it has been widely used. However, cyanide is highly toxic, so there are many problems concerning the working environment and waste liquid treatment. [0003] As a non-cyanide and low toxicity gold plating solution, as described in the following patent 1, a gold plating solution in which gold sulfite is dissolved has been widely used. However, in this gold plating solution, sulfite ions in the solution are easily oxidized by di...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/48
CPCC25D17/10C25D3/48
Inventor 榊原利明河瀬康弘水谷文一石川诚铃木芳英泽井敬一
Owner MITSUBISHI CHEM CORP
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