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Replacement gold plating solution for copper material and gold plating method using the same

A technology of gold plating liquid and gold ions, which is applied in metal material coating process, liquid chemical plating, coating, etc., can solve the problem that gold film cannot be obtained, replacement reaction cannot be carried out normally, gold film gold film and copper material Adhesion problems and other problems

Active Publication Date: 2009-07-01
EEJA LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When using this gold plating solution to plate gold on the surface of copper materials, the replacement reaction between copper materials and gold cannot proceed normally.
As a result, the appearance of the gold film and the adhesion between the gold film and the copper material have problems, and a uniform gold film cannot be obtained.

Method used

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  • Replacement gold plating solution for copper material and gold plating method using the same
  • Replacement gold plating solution for copper material and gold plating method using the same
  • Replacement gold plating solution for copper material and gold plating method using the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0049] A gold plating solution with a pH value of 6.0 containing sodium gold sulfite, measured as Au at 3 g / L, and EDTA at a pH of 6.0, kept at a temperature of 70°C. The sample substrates were soaked in the plating solution for 30 minutes. After 30 minutes, the sample was taken out, and the deposited film thickness was measured using a fluorescent X-ray film thickness measuring device SFT3200 manufactured by SII Corporation. The thickness of the gold film after 30 minutes was 0.05 μm. The surface of the coating was observed visually and with a solid microscope, and the resist did not change color. The color of the deposited gold film is uniform lemon yellow. That is, when the color of the gold coating was visually observed, it was a good appearance that there were no streaks in the appearance, and no decomposition of the plating solution was found.

[0050] Here, the criteria for judging the streaks on the surface of the plating layer are as follows.

[0051] Mottled: Refe...

Embodiment 2

[0055] The gold plating solution containing sodium gold sulfite measured as Au is 3g / L, nitrilotriacetic acid is 50g / L pH value 6.0, keeps liquid temperature 70 ℃, other parts carry out the same operation with embodiment 1. The thickness of the gold film after 30 minutes was 0.05 μm, and the resist was not discolored. The color of the deposited gold film was lemon yellow, and the appearance without streaks was a good appearance, and no decomposition of the plating solution was observed.

Embodiment 3

[0057] Containing sodium gold sulfite as Au is 3g / L, and iminodiacetic acid is 50g / L of gold plating solution with a pH value of 6.0. The liquid temperature is maintained at 70°C, and the other parts are operated in the same manner as in Example 1. The thickness of the gold film after 30 minutes was 0.04 μm, and the resist was not discolored. The color of the deposited gold film was lemon yellow, and the appearance without streaks was a good appearance, and no decomposition of the plating solution was observed.

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Abstract

A replacement electroless gold plating solution used for copper material does not contain the sulfites except for gold sulfite salt and is used for copper material. The contained gold sulfite salt is 0.5-10g / L measured with concentration of gold ion, and the water-soluble amino carboxylic acid compound is 10-150g / L. The water-soluble amino carboxylic acid compound can stabilize the gold sulfite complex and has the function as the complexing agent of metal impurities. Thus, although the gold plating solution according to the invention does not contain sulfite, the self decomposition in the plating solution of gold sulfite salt can be restrained and higher liquid stability is represented.

Description

technical field [0001] The present invention relates to a replacement electroless gold plating solution which can directly perform gold plating on a fine wiring pattern formed on a copper material, and a gold plating method using the gold plating solution. The electroplating solution of the present invention can directly electroplate copper materials without electroless nickel plating and does not contain cyanide compounds. Background technique [0002] In recent years, electronic devices such as mobile phones and notebook computers have been advancing towards weight reduction, miniaturization, and high performance due to technological progress. As electronic materials for these electronic devices, printed circuit boards can be used. Among these printed circuit boards, there is a large demand for flexible and bendable substrates. [0003] A fine wiring pattern made of copper material is formed on the surface of the printed circuit board. As the surface treatment of fine w...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/42
CPCC23C18/16C23C18/52
Inventor 古川诚人
Owner EEJA LTD
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