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Wired circuit board

A technology for wiring circuit substrates and substrates, applied in circuit substrate materials, printed circuits, printed circuits, etc., can solve the problems of increased transmission loss of conductor layout, achieve good long-term reliability, ensure long-term reliability, and improve adhesion Effect

Inactive Publication Date: 2008-01-30
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In this suspension board with circuit, since the metal supporting board is formed of stainless steel, the transmission loss in the conductor pattern increases.

Method used

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  • Wired circuit board
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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0062] First, prepare a metal supporting substrate made of stainless steel with a thickness of 25 μm (refer to FIG. Then, a first insulating base layer made of polyimide having a thickness of 10 μm was formed by the above pattern (see FIG. 2( b )).

[0063] Then, a chromium thin film with a thickness of 0.03 μm and a copper thin film with a thickness of 0.07 μm were sequentially formed as the first metal thin film by chromium sputtering and copper sputtering on the entire surface of the first insulating base layer (see FIG. 2( c )). Next, a dry film resist is provided on the surface of the first metal thin film, and it is exposed and developed, thereby forming a coating protective film of a layout opposite to that of the metal foil with the above-mentioned layout (refer to FIG. 2( d ) ). Then, a copper foil having a thickness of 4.0 μm was formed as a metal foil by electrolytic copper plating on the surface of the first metal thin film exposed from the plating protection film...

Embodiment 2

[0071] Except that the second metal thin film is not formed, and the second insulating base layer is formed on the first insulating base layer to cover the upper surface and both sides in the width direction of the metal foil and the two sides in the width direction of the first metal film, other processes and embodiments 1 is the same to obtain a suspension board with a circuit.

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Abstract

A wired circuit board has a metal supporting board, a first insulating layer formed on the metal supporting board, a first metal thin film formed on the first insulating layer, a metal foil formed on the first metal thin film, a second insulating layer formed on the first insulating layer to cover the metal foil, and a conductive pattern formed on the second insulating layer.

Description

technical field [0001] The present invention relates to a wired circuit board, and more particularly to a wired circuit board such as a suspension board with circuit. Background technique [0002] Conventionally, there is known a suspension board with circuit in which an insulating layer made of resin and a conductor pattern made of copper are sequentially formed on a metal supporting board made of stainless steel. [0003] In this suspension board with circuit, since the metal supporting board is formed of stainless steel, the transmission loss in the conductor pattern increases. [0004] Therefore, in order to reduce the transmission loss, for example, it is proposed to arrange the lower conductor made of copper alloy on the lower layer of the conductors of the printed recording side circuit and the reproduction side circuit, that is, on the insulating layer formed on the suspension ( For example, refer to Japanese Patent Application Laid-Open No. 2005-11387). Contents ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/05G11B5/60
CPCH05K3/4644H05K1/056H05K3/108H05K1/0218H05K3/181H05K1/0237H05K2201/0723H05K3/388
Inventor 石井淳要海貴彦
Owner NITTO DENKO CORP