Lead-free solder for soft soldering

A lead-free solder and soft soldering technology, applied in the field of lead-free solder containing cerium, bismuth, copper, nickel, lead-free solder, praseodymium or/and neodymium and the balance of tin, can solve the problem of high precious metal content, The problems of poor wettability and high cost can achieve the effect of good product quality, improved bending resistance and low cost

Inactive Publication Date: 2008-03-12
郴州金箭焊料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, lead-free solder has gradually been widely used in my country's electronic information product manufacturing industry. In order to better and more effectively promote the process of lead-free electronic information products in my country, the industry standard for lead-free solder has been formulated. The development of lead-free solder is more powerful, but some lead-free solders have high precious metal content, high cost, some have high melting point, and some have poor wettability and other deficiencies.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] Test results of Example 1: expansion rate: 77.0%, wettability: 65.6mN, melting point: 215°C, metallography (200 times magnification): uniform metallographic structure, fine grain, resistivity: 1.30μ′Ω .cm, QFP lead 45° tensile test: 24.25N, chip component solder joint shear test: 30.00N.

Embodiment 2

[0027] Test results of Example 2: expansion rate: 77.2%, wettability: 65.4mN, melting point: 217°C, metallographic (200 times magnification): uniform metallographic structure, fine grain, resistivity: 1.30μ′Ω .cm, QFP lead 45° tensile test: 24.23N, chip component solder joint shear test: 31.20N.

Embodiment 3

[0028] Test results of Example 3: expansion rate: 77.8%, wettability: 65.8mN, melting point: 218°C, metallographic (200 times magnification): uniform metallographic structure, fine grain, resistivity: 1.31μ'Ω .cm, QFP lead 45° tensile test: 24.00N, chip component solder joint shear test: 31.10N.

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PUM

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Abstract

The present invention relates to a lead-free solder for a soldering which is characterized in that the solder consists of materials with the following weight percentage: Cu from 0.1 percent to 1.0 percent, Ni from 0.1 percent to 0.2 percent, Ce from 0.01 percent to 0.10percent, Bi from 0.05percent to 2.0percent, Pr or/and Nd from 0.01percent to 0.10percent and the rest being Sn. The lead-free solder of the present invention, belonging to the environmental protecting products, has the advantages and effects of such as an anti-oxidation property, a mechanical property and corrosion resistance which can improve the performance of the solder, a uniform metallographic organization, refined grain, a good product quality, low cost and a proper reduction of the melting point.

Description

technical field [0001] The invention relates to a lead-free solder for soldering, in particular to a lead-free solder containing copper, nickel, cerium, bismuth, praseodymium or / and neodymium and tin as the balance, belonging to the field of tin solder alloys. Background technique [0002] The rapid development of the electronics industry has higher and higher requirements for solder performance, and the development of high-integration, high-performance electronic and electrical design has made the solder joints smaller and smaller, and the requirements for reliability are getting higher and higher. Traditional tin-lead solder, lead and its compounds are toxic substances, which bring great harm to the human living environment and safety. The European Union issued two directives. From July 1, 2006, electronic products must not contain lead, etc Lead is the first to bear the brunt of the six harmful substances in the chemical industry, so the research and application of lead-f...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26
Inventor 邓和升杨立明卢斌邓曦邓振华
Owner 郴州金箭焊料有限公司
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