Aqueous epoxy resin and preparation method and method for preparing varnish by using aqueous epoxy resin

A technology of water-based epoxy resin and epoxy resin, applied in the direction of epoxy resin coating, coating, etc., can solve the problem of not maintaining the properties of epoxy resin well, and achieve the effect of excellent curing performance

Inactive Publication Date: 2008-04-09
XI AN JIAOTONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the introduction of water-based substances through chemical modification includes the introduction of methyl p-hydroxybenzoate or p-aminobenzoic acid, etc., but the introduction of polar groups will open the epoxy group, so the epoxy resin cannot be well maintained. its own nature

Method used

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  • Aqueous epoxy resin and preparation method and method for preparing varnish by using aqueous epoxy resin
  • Aqueous epoxy resin and preparation method and method for preparing varnish by using aqueous epoxy resin
  • Aqueous epoxy resin and preparation method and method for preparing varnish by using aqueous epoxy resin

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Preparation of water-based epoxy resin: Add 10 grams of 2,2-dimethylolpropionic acid, 30 grams of acetone, 17 grams of toluene diisocyanate, 100 grams of epoxy resin E- 44, heated to 60°C, and stopped the reaction at this temperature for 5 hours.

[0025] 100g of the prepared water-based epoxy resin was neutralized with 65g of aqueous sodium hydroxide solution (2g of sodium hydroxide), then it was emulsified with a stirrer, stirred at a high speed for 20 minutes, and the rotating speed was 1000 rpm to obtain a solid content A 60% stable water-based epoxy emulsion.

[0026] Viscosity: 2300mp.s

[0027] Epoxy equivalent: 0.17mol / 100g

[0028] Stability of epoxy resin emulsion: Centrifugal stability: 2000 rpm, no delamination in 30 minutes.

[0029] Preparation of water-based epoxy varnish: take 10g of modified epoxy resin emulsion, cure with 1 gram of diethylenetriamine, stir well until mixed evenly, mature for 5 minutes for coating, the curing condition is normal temp...

Embodiment 2

[0033] Preparation of water-based epoxy resin: Add 12 grams of 2,2-dimethylol propionic acid, 20 grams of acetone, 17 grams of toluene diisocyanate, 100 grams of epoxy resin E- 44, heated to 50°C, and stopped the reaction at this temperature for 6 hours.

[0034] The water-based epoxy resin 100g that will make is neutralized with aqueous sodium hydroxide solution 75g (wherein sodium hydroxide 2.5g), then it is emulsified with a stirrer, stirred at a high speed for 20 minutes, and the rotating speed is 1000 revs / min to obtain a solid 55% stable aqueous epoxy emulsion.

[0035] Viscosity: 2400mp.s

[0036] Epoxy equivalent: 0.19mol / 100g

[0037] Stability of epoxy resin emulsion: Centrifugal stability: 2000 rpm, no delamination in 30 minutes.

[0038] Preparation of water-based epoxy varnish: Take 10g of modified epoxy resin emulsion, solidify with 2g of polyamide, stir well until mixed evenly, mature for 5 minutes for coating, the curing condition is normal temperature (temp...

Embodiment 3

[0042] Preparation of water-based epoxy resin: Add 12 grams of 2,2-dimethylolpropionic acid, 10 grams of acetone, 15 grams of toluene diisocyanate, 100 grams of epoxy resin E- 44, heated to 55°C, and stopped the reaction at this temperature for 5 hours.

[0043] 100g of the prepared water-based epoxy resin was neutralized with 85g of sodium hydroxide aqueous solution (wherein sodium hydroxide 3g), and then it was emulsified with a stirrer, stirred at a high speed for 20 minutes, and the rotating speed was 1000 rpm to obtain a solid content A 50% stable water-based epoxy emulsion.

[0044] Viscosity: 2700mp.s

[0045] Epoxy equivalent: 0.19mol / 100g

[0046] Stability of epoxy resin emulsion: Centrifugal stability: 2000 rpm, no delamination in 30 minutes.

[0047] Preparation of water-based epoxy varnish: Take 10g of modified epoxy resin emulsion, solidify with 2g of urea, stir well until mixed evenly, mature for 5 minutes for coating, the curing condition is normal temperatu...

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Abstract

The present invention provides a modified waterborne epoxy resin by using 2, 2-bis (hydroxymethyl) propionic acid and diisocyanate and a preparation method thereof, the resin is prepared by reaction and synthesis at 50 to 65 DEG C after the mixing of 100 parts of epoxy resin, 10 to 12 parts of 2, 2-bis (hydroxymethyl) propionic acid, 15 to 17 parts of toluene diisocyanate and 50 to 60 parts of cosolvent according to the weight parts. The present invention also provides the preparation method of preparing emulsion varnish by the waterborne epoxy resin, the waterborne epoxy resin is neutralized by using the alkaline aqueous solution and is prepared into the stable waterborne epoxy emulsion with the solid content of 50 to 60 percent by emulsifying, and the curing agent is added, so the present invention can be used as the environment-friendly varnish. The waterborne epoxy resin which is prepared by the present invention has the technical characteristics of fine particles, high emulsion stability and high hardness of the cured products, etc., so the present invention can be widely applied to the coatings, adhesives, fine chemical additives and other fields.

Description

technical field [0001] The invention relates to a water-based epoxy resin, a preparation method thereof and a method for preparing varnish with the water-based epoxy resin. Background technique [0002] Epoxy resin is a general term for compounds that contain two or more epoxy groups in one molecule and form a three-dimensional cross-linked cured product in the presence of appropriate chemical reagents. Because of its unique epoxy group, hydrocarbon group, ether bond and other active groups and polar groups in its molecular structure, it has excellent physical and mechanical properties, mechanical properties, electrical insulation properties, chemical resistance and adhesive properties. , Widely used in coatings and plastic packaging, casting of electronic materials, molding materials, adhesives, laminated materials, composite material substrates, etc., infiltrated into all aspects from daily necessities to high-tech fields in the form of direct or indirect use. However, co...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/16C09D163/00
Inventor 曹瑞军高颖
Owner XI AN JIAOTONG UNIV
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