Exposure method, exposure device, and device manufacturing method

Abstract

By adjusting optical characteristics of an optical system (PLL) by irradiation of a movable optical element (90) with a non-exposure light by an irradiation device (91) and adjusting optical characteristics of the optical system (PLL) by moving the optical element (90) by the optical characteristic adjustment device, it is possible to correct, for example, fluctuation of the optical characteristics of the optical system attributed to the temperature distribution of the optical element around the position eccentric from the optical axis. Moreover, under the dipole illumination condition, in order to facilitate correction by the optical characteristic adjustment device, the optical characteristic of the optical system attributed to temperature distribution of non-rotational symmetry of the optical element in the vicinity of pupils (PP1, PP2, PP3), the irradiation device (91A) irradiates a non-exposure light tot he optical element (111) so that the optical element (111) has a temperature distribution of rotational symmetry. Thus, it is possible to effectively correct the fluctuation of the optical characteristics of the optical system attributed to the illumination light absorption.

Description

technical field [0001] The present invention relates to an exposure method, an exposure device, and a device manufacturing method, and more specifically relates to an exposure method and an exposure method used in a lithography step for manufacturing electronic devices such as semiconductor elements (integrated circuits) and liquid crystal display elements. A device, and a device manufacturing method using the exposure method and the exposure device. Background technique [0002] In the past, in the photolithography steps of electronic devices (micro devices) such as semiconductor elements (integrated circuits, etc.) and liquid crystal display elements, step-and-repeat reduction projection exposure apparatuses (so-called stepper exposure apparatuses) were mainly used. ) or a step-and-scan reduction projection exposure device (so-called scanning stepper exposure device), etc., which project the pattern image of the mask (or reticle) onto the resist-coated surface through the ...

AI Technical Summary

Problems solved by technology

[0006] However, the aberration variation caused by the temperature distribution as shown in the contour diagram of FIG. 16(B) is difficult to correct the imaging characteristics generally used in the exposure device, such as making the lens constituting a part of the projection optical system face up or down or Corrected in the mechanism of tilting movement

For example, when the lens is moved up and down, the aberration can be changed around the optical axis AX, but it is difficult to correct the above-mentioned aberration fluctuation around the point off the optical axis AX.

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