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Laminated body used to produce printed wiring board, and method of producing printed wiring board using the same

A technology of printed circuit boards and laminates, applied in the fields of printed circuit, printed circuit, printed circuit manufacturing, etc., to achieve the effect of excellent viscosity and excellent high-frequency characteristics

Inactive Publication Date: 2008-04-23
FUJIFILM CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method is used to form high-definition patterns, but there is room for improvement in the bonding strength of conductive materials

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1 to 5

[0256] (forms an adhesive layer on the surface of the carrier)

[0257] A polyethylene terephthalate film having a thickness of 16 μm that was not subjected to surface treatment or pretreatment was prepared and used as a support for forming an adhesive layer.

[0258] Using stick #6, polymer precursor composition 1 having the following composition was coated on the support surface and dried at 100° C. for 1 minute, thereby forming a polymer precursor layer [(B) layer], wherein the polymer Precursor composition 1 includes a polymer containing acrylic group as a polymerizable compound and a carboxyl group as a reactive group (polymer containing a polymerizable group on a side chain: P-1, obtained using the synthesis example described below ) inclusive. The thickness of the polymer precursor layer is set at 0.2 to 1.5 μm.

[0259] (polymer precursor composition liniment 1)

[0260] -Hydrophilic polymer (P-1) having a polymerizable group on the side chain 3.1 g

[0261] - Wate...

specific Embodiment 1

[0266] 300 g of this reaction solution was put into a beaker, and then cooled to 5° C. with an ice bath. While stirring the reaction solution, 41.2 ml of an aqueous sodium hydroxide (4N) solution was added dropwise over about 1 hour. During the dropwise addition, the temperature of the reaction solution was 5 to 11°C. After the dropwise addition, the reaction solution was stirred at room temperature for 10 minutes, and the solid matter was removed by suction filtration to obtain a brown solution. The solution was reprecipitated with 3 liters of ethyl acetate, and the precipitated solid was filtered. The solid was resuspended overnight with 3 liters of acetone. The solid was obtained by filtration, and then dried under vacuum for 10 hours to obtain light brown powder P-1. 1 g of polymer was dissolved in a mixture solvent of 2 g of water and 1 g of acetonitrile. The pH of the solution was 5.56 and its viscosity was 5.74 cps. Viscosity was measured using a viscometer (trade ...

specific Embodiment 2

[0272] (Specific embodiment 2: form active species generation layer 2)

[0273] 5g of liquid bisphenol A epoxy resin (epoxy equivalent 176, trade name: EPIKOTE 825, produced by JapanEpoxy Resins Co., Ltd.), 2g of MEK varnish (trade name: PHENOLITE LA -7052, produced by Dainippon Ink And Chemicals, Inc., non-volatile components 62%, phenolic hydroxyl equivalent of non-volatile components 120), 10.7g phenoxy resin MEK varnish (trade name: YP-50EK35, produced by Tohto Kasei Co., Ltd. production, non-volatile content 35%), 2.3 g of 1-[4-(2-hydroxyethoxy)phenyl]-2-hydroxy-2-methylpropane- 1-Kone, 5.3 g of MEK, and 0.053 g of 2-ethyl-4-methylimidazole were mixed and stirred so as to dissolve completely, resulting in a varnish-like epoxy resin composition. This epoxy resin varnish was coated on the polymer precursor layer [(B) layer] with a coater so that the epoxy resin varnish had a thickness of 90 μm after drying. Then, the epoxy resin varnish is dried at a temperature of 80 to ...

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PUM

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Abstract

The present invention provides a laminated body for producing a printed wiring board, which includes an adhesive layer that is provided between an insulating film for a printed wiring board and a metal film for forming wiring. The adhesive layer includes an active species generating composition that is capable of generating an active species having reactivity by energy application, and a polymer precursor composition that includes a compound capable of forming a polymer compound by reaction with the active species generating composition. The invention also provides a method of producing a printed wiring board.

Description

technical field [0001] The present invention relates to a laminate for producing a printed circuit board, and a method for producing a printed circuit board. In particular, the present invention relates to a laminate for producing a printed circuit board having high-density wiring for use in electronic materials, and to a method for producing a printed circuit board which can form a high Density lines. Background technique [0002] In recent years, high-performance electronic equipment is required, and electronic devices are increasingly highly integrated and fixed at higher densities. Accordingly, printed wiring boards suitable for high levels of integration and high assembly density are reduced in size and increased in density. Various methods, such as a method of forming stable high-definition lines and a method of using a multilayer build-up circuit board, are being studied to accommodate the increased integration of printed circuit boards. However, multilayer built-u...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K3/38
CPCH05K2203/1163H05K3/387H05K2201/0195H05K2203/1105Y10T428/2804
Inventor 鹤见光之
Owner FUJIFILM CORP
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