Removable pressure-sensitive adhesive composition and pressure-sensitive adhesive tape or sheet

A pressure-sensitive adhesive and pressure-sensitive adhesive layer technology, applied in the field of pressure-sensitive adhesive compositions, pressure-sensitive adhesive tapes or sheets, can solve the problem of reducing the reactivity of UV-curable compounds, difficult to completely Prevent low molecular weight components from migrating, migrating, etc.

Active Publication Date: 2008-06-11
NITTO DENKO CORP
View PDF3 Cites 34 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, in such an ultraviolet light-curable pressure-sensitive adhesive sheet for fixing a semiconductor wafer, the pressure-sensitive adhesive layer formed on the base material has the property of reducing the adhesive strength by crosslinking and curing by ultraviolet light irradiation, It has a problem that the low molecular weight component (photopolymerization initiator) contained in the pressure-sensitive adhesive layer migrates to the substrate side, thereby lowering the reactivity of the UV-curable compound, which makes it impossible to occur through cross-linking. The smooth curing of the joint to achieve the result of the reduction of the adhesive strength of the pressure-sensitive adhesive sheet
However, it is also difficult to completely prevent migration of low molecular weight components (see JP-A-11-263946 and JP-A-2000-281991)

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Removable pressure-sensitive adhesive composition and pressure-sensitive adhesive tape or sheet

Examples

Experimental program
Comparison scheme
Effect test

preparation Embodiment 1

[0105] Copolymerize 75 parts by weight of methyl acrylate, 10 parts by weight of methoxyethyl acrylate, 10 parts by weight of N-vinylpyrrolidone and 5 parts by weight of 2-hydroxyethyl acrylate in ethyl acetate , to obtain a solution containing an acrylic acid copolymer (sometimes referred to as an acrylic acid copolymer solution (A)).

[0106] Then, 60 parts by weight of 2-methacryloyloxyethyl isocyanate was added to the above-mentioned solution (A) containing acrylic acid copolymer, and then 0.1 part by weight of dibutyltin dilaurate was added as a catalyst, and then it was heated at 50° C. The reaction was carried out for 24 hours to obtain a solution containing a double bond-introducing type acrylic polymer (weight average molecular weight: 500,000) having a carbon-carbon double bond at the end of the side chain (solution (A) containing a double bond-introducing type acrylic polymer). The double bond-introducing type acrylic polymer has the form of isocyanate groups of 2-m...

preparation Embodiment 2

[0109] Copolymerize 75 parts by weight of methyl acrylate, 10 parts by weight of methoxyethyl acrylate, 10 parts by weight of N-vinylpyrrolidone and 10 parts by weight of 2-hydroxyethyl acrylate in ethyl acetate , to obtain a solution containing an acrylic acid copolymer (sometimes referred to as an acrylic acid copolymer solution (B)).

[0110] Then, 12 parts by weight of 2-methacryloyloxyethyl isocyanate was added to the above-mentioned solution (B) containing acrylic acid copolymer, and then 0.1 part by weight of dibutyltin dilaurate was added as a catalyst, and then it was heated at 50° C. The reaction was carried out for 24 hours to obtain a solution containing a double bond-introducing type acrylic polymer (weight-average molecular weight: 600,000) having a carbon-carbon double bond at the end of the side chain (solution (B) containing a double bond-introducing type acrylic polymer). The double bond-introducing type acrylic polymer has the form of isocyanate groups of 2-...

preparation Embodiment 3

[0113] A UV-curable acrylic pressure-sensitive adhesive solution (sometimes referred to as pressure-sensitive adhesive solution (C)) was prepared in the same manner as in Preparation Example 1 of the UV-curable acrylic adhesive solution, except that The photopolymerization initiator (trade name "Irgacure 2959", manufactured by Ciba Specialty Chemicals Co.) was replaced with a photopolymerization initiator (trade name "Irgacure 651", manufactured by Ciba Specialty Chemicals Co.).

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
diameteraaaaaaaaaa
thicknessaaaaaaaaaa
Login to view more

Abstract

The present invention relates to a removable pressure-sensitive adhesive composition containing an acrylic polymer, a photopolymerization initiator and a crosslinking agent, in which the acrylic polymer and the photopolymerization initiator each are chemically bonded to the crosslinking agent. The present invention also relates to a removable pressure-sensitive adhesive composition containing an acrylic polymer and a photopolymerization initiator, the composition further containing a crosslinking agent having a reactive functional group which is capable of reacting with a reactive functional group of the acrylic polymer and a reactive functional group of the photopolymerization initiator.

Description

technical field [0001] The present invention relates to a pressure-sensitive adhesive composition and a pressure-sensitive adhesive tape or sheet using the same. More particularly, the present invention relates to a pressure-sensitive adhesive tape or sheet for dicing, which is used for fixing a material to be diced, such as a semiconductor wafer, when cutting (dicing) a semiconductor wafer or the like into device chips ; Also involves picking up pressure-sensitive adhesive tapes or sheets, which are used to separate (pick up) the materials to be cut that have been cut, respectively. Background technique [0002] Traditionally, semiconductor wafers made of materials such as silicon, germanium or gallium-arsenic are usually produced in large diameter form, which are then background to a given thickness and further backside processed as required (e.g. etching or polishing). Then, a pressure-sensitive adhesive tape or sheet for dicing (the term "tape or sheet" is hereinafter ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): C09J133/02C09J7/02
CPCC08L2312/06H01L21/6836H01L2221/68327C09J139/06C09J2203/326C09J2205/302C08K5/0025C09J7/0217H01L2924/3025C09J2205/31C09J2205/102C09J7/385Y10T428/2809C09J2301/502C09J2301/408C09J2301/416C09J7/38
Inventor 佐佐木贵俊浅井文辉新谷寿朗高桥智一
Owner NITTO DENKO CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap