33results about How to "Reduced bond strength" patented technology

With the invented dicing method, by increasing the cohesive strength while decreasing the adhesive strength of an ultraviolet-curing adhesive in advance, mixing of the ultraviolet-curing adhesive layer of an adhesive sheet with a die attach film on a dicing line can be decreased and pickup failures can be reduced, when picking up chips having a die attach film after dicing. The dicing method for a semiconductor wafer with a die-attach film comprises a first gluing step in which a die attach film is affixed to an adhesive sheet having an ultraviolet-curing adhesive laminated on a base materialfilm, a second gluing step in which a semiconductor wafer is affixed to the opposite side of the die attach film affixed to the adhesive sheet, an ultraviolet irradiation step in which the ultraviolet-curing adhesive is irradiated with ultraviolet light, and a dicing step in which the semiconductor wafer and the die attach film affixed to the adhesive sheet are diced.

The present disclosure provides a foldable display protective film having variable adhesive strength and a foldable display device including the same.

Provided is an adhesive that has favorable adhesive strength for use in the untreated surface material of an untreated polyester film or the like; suppresses a decrease in adhesion strength over time, even in outdoor exposure conditions; and is capable of maintaining adhesion strength over a long period of time. This polyurethane adhesive is a polyurethane adhesive using a main agent and a curing agent, wherein the main agent contains a specific polyester polyol (A), a specific polycarbonate polyurethane polyol (B), and a specific bisphenol type epoxy resin (C) at a specific ratio, and the curing agent contains a specific amount of a polyisocyanate component with an isocyanurate skeleton.

The invention provides a rubber type pressure-sensitive adhesive as well as a preparation method and an application thereof. The rubber type pressure-sensitive adhesive comprises the following substances in parts by weight: 100 parts of butyl rubber, 30-70 parts of polyisobutene, 30-90 parts of solid terpene resin, 30-70 parts of liquid terpene resin and 150-250 parts of superfine kaolin. The rubber type pressure-sensitive adhesive disclosed by the invention has high strength and shallow color, is the solvent-free unvulcanized rubber type pressure-sensitive adhesive and can be used as a pressure-sensitive adhesive in self-adhesion rubber waterstops used in the railway.

The invention relates to a bio-degradable heat-viscose bi-component filament fiber, which comprises a surface fiber layer and is characterized in that a plurality of core-layer fibers are arranged at the center of the surface fiber layer. The invention further relates to a production method of the bio-degradable heat-viscose bi-component filament fiber, which is characterized by including the following processes of (1) drying poly butylenes succinate and polylactic acid in a vacuum environment; (2) melting and extruding the poly butylenes succinate and the polylactic acid in two screws of a double-screw composite spinning machine, feeding the same into a composite spinning component after being metered by a metering pump, spraying from a composite spinneret plate, cooling to the room temperature, and reeling to form reeled filaments after applying spinning oil; and (3) drafting after balancing the reeled filaments at the room temperature, and accordingly obtaining the bi-component composite filament fiber. The bio-degradable heat-viscose fibers produced by the production method are fine in viscosity, high in strength and better in flexibility and have excellent bio-degradation and absorbability for human bodies.

The present invention relates to an adhesive sheet for temporary attachment and a semiconductor device producing method using same, wherein the adhesive sheet has excellent heat-resistance, and thus can implement a sufficient adhesive force even when going through a high-temperature process among semiconductor producing processes and can exhibit sufficient reduction of an adhesive force through photocuring in a separation step.

Disclosed is a manufacturing method of an aluminum alloy cavity board for furniture. Two or more aluminum alloy cavity veneers are bonded and spliced in a side surface parallel mode, and the side surfaces of the aluminum alloy cavity veneers are bonded and spliced in parallel. The aluminum alloy cavity board for the furniture is manufactured through the manufacturing method of the aluminum alloy cavity board for the furniture. Compared with an existing large-size profile extrusion technology and an existing welded profile, the bonded aluminum alloy cavity board is high in splicing and forming speed, high in flexibility, small in flatness tolerance and small in weight, the demands of different application fields can be met, the operation is convenient and fast, and therefore the purposes of saving raw materials and reducing product manufacturing cost are achieved.