Pressure-sensitive adhesive sheet for dicing and dicing method

A technology for adhesive sheets and slices, applied in the direction of film/sheet adhesives, adhesive types, ester copolymer adhesives, etc., to achieve the effect of reducing adhesive strength, saving energy, and improving productivity

Active Publication Date: 2009-03-11
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

That is, an adhesive sheet for dicing that can control adhesiveness so as to exhibit sufficiently strong adhesiveness when adhesiveness is required and exhibit easy peeling when peeling is required has not been found so far. properties, it is possible to prevent the adhesive from adhering to the adherend caused by rolling up part of the adhesive caused by the circular scraper when slicing the adherend, and it is possible to easily peel off unnecessary adhesive sheets without Contamination of adherend and ring when the sheet is peeled off

Method used

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  • Pressure-sensitive adhesive sheet for dicing and dicing method
  • Pressure-sensitive adhesive sheet for dicing and dicing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0068] A 70 μm thick film made of linear low density polyethylene was used as a substrate. One side of the film was corona treated.

[0069] Also, 60 parts by weight of methyl acrylate, 30 parts by weight of 2-ethylhexyl acrylate, and 10 parts by weight of 2-hydroxyethyl acrylate were mixed to prepare a monomer solution.

[0070] Nitrogen is introduced into the reactor equipped with nitrogen introduction pipe, thermometer and stirrer, then add 400g ethyl acetate, 60g methyl acrylate, 30g 2-ethylhexyl acrylate, 10g acrylic acid and 0.2g AIBN ( azobisisobutyronitrile), and stirred at 60°C for 24 hours. Thereafter, the whole was cooled to room temperature to obtain an acrylic copolymer solution 1 containing an acrylic copolymer (weight average molecular weight: 600,000).

[0071] To the above-mentioned acrylic copolymer solution 1 were added 40 parts by weight of an ultraviolet curable oligomer (viscosity at 25°C: 10 Pa·sec) obtained by reacting pentaerythritol triacrylate and ...

Embodiment 2

[0074] Acrylic copolymer solution 2 comprising an acrylic copolymer having a carbon-carbon double bond at the terminal and having a weight average molecular weight of 600,000 was obtained by adding 12 parts by weight of 2-methacryloxyethylene Isocyanate was added to the same acrylic copolymer solution 1 as in Example 1, and they were reacted to introduce NCO groups into 90% OH groups at the end of 2-hydroxyethyl acrylate side chains in the copolymer.

[0075] Then, to this acrylic copolymer solution 2, 20 parts by weight of an ultraviolet curable oligomer (viscosity at 25°C: 10 Pa·sec) obtained by reacting pentaerythritol triacrylate and diisocyanate in equal amounts, 2 parts by weight Parts of photopolymerization initiator (trade name "Irgacure 651", manufactured by Ciba Specialty Chemicals Co.) and 3 parts by weight of polyisocyanate compound (trade name "Coronate L", manufactured by Nippon Polyurethane Co., Ltd.), thereby obtaining ultraviolet curing Type acrylic adhesive s...

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Abstract

The present invention relates to a pressure-sensitive adhesive sheet for dicing comprising a substrate layer and an active energy ray-curable pressure-sensitive adhesive layer provided on the substrate layer, in which the active energy ray-curable pressure-sensitive adhesive layer has a gel fraction before irradiation with an active energy ray of 50% or more. Furthermore, the invention also provides a method for dicing an adherend, which comprises attaching the pressure-sensitive adhesive sheet for dicing to an adherend, followed by cutting the adherend using a round blade. The pressure-sensitive adhesive sheet for dicing of the invention is free from leaving any adhesive residue on chips, from peeling of the pressure-sensitive adhesive sheet from the ring for fixing it, as well as from leaving any paste residue on the ring.

Description

technical field [0001] The present invention relates to an adhesive sheet for dicing. More specifically, the present invention relates to an adhesive sheet for slicing for slicing semiconductor wafers, semiconductor packages, glass or ceramics made of materials such as silicon or gallium-arsenic. Background technique [0002] Semiconductor wafers made of materials such as silicon, germanium, or gallium-arsenic are produced in large diameter form, after which they are back ground to obtain a given thickness, and, if necessary, further back processed (e.g., etched, polished, etc.), then diced ( slicing) to produce semiconductor chips. More specifically, an adhesive sheet for dicing is attached to the back surface of a semiconductor wafer (mounting step), the wafer is cut into element pieces (chips), and various steps such as a cleaning step, an expanding step, and picking up are subsequently performed. steps to form chips. With respect to the semiconductor wafer, by bonding...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/02C09J133/04H01L21/78H01L21/301C03B33/00
CPCY10T156/1052C09J7/0217Y10T428/2891H01L21/6836C09J2203/326C09J2201/622Y10T428/28C09J2205/31H01L2221/68327C09J7/385C09J2301/312C09J2301/416C09J7/38
Inventor 高桥智一
Owner NITTO DENKO CORP
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