Method for improving solar battery diffusion
A solar cell and resistivity technology, which is applied in circuits, electrical components, sustainable manufacturing/processing, etc., can solve the problems of high resistivity monocrystalline silicon solar cells that are difficult to achieve high conversion efficiency, and achieve low consumption of raw materials and time , Simple operation and convenient use
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example 1
[0037] Example 1: A method for improving the diffusion characteristics of solar cells, the steps are as follows:
[0038] 1) Raw materials used:
[0039] P-type monocrystalline silicon, thickness 280um~300um, resistivity 0.5~7Ωcm
[0040] 2) Diffusion
[0041] Diffusion temperature: 840 or 850 or 860 or 870°C
[0042] Gas flow rate: large nitrogen 25L / min, small nitrogen 2.2L / min, dry oxygen 2.2L / min; duration: 30min
[0043] 3) Oxygen redistribution
[0044] Temperature: 840 or 850 or 860 or 870°C
[0045] Gas flow rate: large nitrogen 25L / min, small nitrogen 0L / min, dry oxygen 3L / min; duration: 10min
[0046] 4)Drive in
[0047] Temperature: 840 or 850 or 860 or 870°C
[0048] Gas flow rate: large nitrogen 25L / min, small nitrogen 0L / min, dry oxygen 0 / min; duration: 10min. The sheet resistance of the silicon wafer surface is 30-34Ω / □.
[0049] The difference in performance between batteries using two different diffusion processes, please see Table 1-1, 1-2 below
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example 2
[0054] Example 2: a method for improving the diffusion characteristics of solar cells, the steps are as follows:
[0055] 1) Raw materials used:
[0056] P-type monocrystalline silicon, thickness 280um~300um, resistivity 0.5~7Ωcm
[0057]2) Diffusion (changing temperature)
[0058] Diffusion temperature: 835 or 855 or 865 or 875°C
[0059] Gas flow rate: large nitrogen 25L / min, small nitrogen 2.2L / min, dry oxygen 2.2L / min; duration: 30min
[0060] 3) Oxygen redistribution
[0061] Temperature: 835 or 855 or 865 or 875°C
[0062] Gas flow rate: large nitrogen 25L / min, small nitrogen 0L / min, dry oxygen 3L / min; duration: 10min
[0063] 4)Drive in
[0064] Temperature: 835 or 855 or 865 or 875°C
[0065] Gas flow rate: large nitrogen 25L / min, small nitrogen 0L / min, dry oxygen 0 / min; duration: 10min. The sheet resistance of the silicon chip surface is 31-33Ω / □. Please see Table 2-1 and 2-2 below.
[0066] Table 2-1 (without redistribution):
[0067]
[0068] ...
example 3
[0072] Example 3: a method for improving the diffusion characteristics of solar cells, the steps are as follows:
[0073] 1) Raw materials used:
[0074] P-type monocrystalline silicon, thickness 280um~300um, resistivity 0.5~7Ωcm
[0075] 2) Diffusion (increase large nitrogen, dry oxygen flow, reduce small nitrogen flow)
[0076] Diffusion temperature: 845 or 855 or 868 or 877°C
[0077] Gas flow rate: large nitrogen 30L / min, small nitrogen 1.8L / min, dry oxygen 4L / min; duration: 30min
[0078] 3) Oxygen redistribution (increase large nitrogen, dry oxygen flow)
[0079] Temperature: 845 or 855 or 868 or 877°C
[0080] Gas flow rate: large nitrogen 30L / min, small nitrogen 0L / min, dry oxygen 4L / min; duration: 4min
[0081] 4) Drive in (increase the nitrogen flow rate)
[0082] Temperature: 845 or 855 or 868 or 877°C
[0083] Gas flow rate: large nitrogen 30L / min, small nitrogen 0L / min, dry oxygen 0 / min; duration: 10min After the whole process is completed, the surface resi...
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