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LED assembly method

A technology of light-emitting diodes and assembly methods, which is applied to electrical components, electrical solid-state devices, circuits, etc., can solve the problems of complicated processes and poor yield, and achieves the improvement of product yield, reduction of materials used, and easy control of yield. Effect

Inactive Publication Date: 2011-03-16
EVERLIGHT ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Therefore, the object of the present invention is to provide a light-emitting diode assembly method to improve the traditional light-emitting diode packaging process complex process and poor yield.

Method used

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  • LED assembly method
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Embodiment Construction

[0031] Please refer to figure 1 , which shows a flow chart of steps of a method for assembling a light emitting diode according to an embodiment of the present invention.

[0032] As shown in step 110, a base is manufactured, which places a light-emitting chip on a substrate, and performs general processes such as die bonding, baking, and wire bonding. The substrate can be a printed circuit board, a ceramic substrate, a metal substrate or a lead frame. The light-emitting chips can be fixed on the substrate by using adhesive materials, such as organic or inorganic polymer silver glue or alloy materials, and then the wire-bonding process is performed with gold wires or aluminum wires.

[0033] Next, as shown in step 120 , the die-bonded light-emitting chip is packaged with molding resin to form a colloid. Using light-transmitting molding resins such as epoxy resin (Epoxy), polystyrene (Polystyrene; PS), acrylonitrile-butadiene-styrene polymer (Acrylonitrile-Butadiene-Styrene; ...

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Abstract

The present invention discloses a light emitting diode and an assembling method thereof, wherein, the light emitting diode is formed by combining a substrate with a reflector. The surface of the substrate is provided with a colloid which covers a light emitting chip and a plurality of leads; the reflector is provided with a bottom opening, the substrate and the reflector are assembled by pressingthe colloid into the bottom opening to fasten the colloid with the bottom opening.

Description

technical field [0001] The invention relates to an assembly method of a light-emitting diode, and in particular to an assembly method of a light-emitting diode that can simplify the packaging process. Background technique [0002] The purpose of the light emitting diode (LED) package includes protecting the chip from external moisture, oxygen, radiation or external force, improving the reliability of the component and improving the performance of the chip. In addition, different packaging forms can also be used to match different products, increasing the application range of LEDs. [0003] The traditional LED packaging process includes die bonding, baking, wire bonding, compression molding, reflector molding, cutting, electrical testing, and packaging. Among them, everything from solid crystal to reflector molding is carried out on the substrate, and the finished product has a certain thickness after being stacked layer by layer. In order to cut the finished product into in...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/00H01L25/00H01L25/075H01L21/50H01L33/48
Inventor 张正宜
Owner EVERLIGHT ELECTRONICS