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High-strength low thermal expansion A1N nano wire and A1 composite material

A low thermal expansion, composite material technology, applied in the field of nanomaterials, to achieve the effect of increasing the turn-on voltage, reducing the electric field enhancement effect, and solving the shielding effect

Inactive Publication Date: 2008-09-03
INST OF METAL RESEARCH - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

With the rapid development of aerospace, integrated circuit and automobile manufacturing industries, traditional simple, single, multi-phase or conventional composite aluminum matrix and aluminum nitride materials can no longer meet the requirements

Method used

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  • High-strength low thermal expansion A1N nano wire and A1 composite material

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] The yield strength and tensile strength of the composite without AlN nanowires are about 60MPa and 131MPa, respectively. The thermal expansion test in the range of 20-250C shows that the thermal expansion coefficient is 22.29×10 -6 / K.

Embodiment 2

[0021] The AlN nanowires and Al nanoparticles with a volume composition of 4.5vol% are evenly mixed, and the dried mixed powder is hot-pressed into a block. The yield strength and tensile strength of the composite containing 4.5% AlN nanowires are about 3.2 times and 3.3 times that of the matrix without nanowires, respectively. The thermal expansion test in the range of 20-250C shows that adding AlN nanowires can effectively reduce the thermal expansion coefficient of Al, and the thermal expansion coefficient of the composite material containing 4.5% AlN nanowires is 15.24×10 -6 / K, which is 31.6% lower than that of the matrix without nanowires.

Embodiment 3

[0023] The AlN nanowires and the Al nanoparticles with a volume composition of 10.5vol% are evenly mixed, and the dried mixed powder is hot-pressed into a block. The yield strength and tensile strength of the composite containing 10.5% AlN nanowires are about 3.7 times and 4.2 times that of the matrix without nanowires, respectively. The thermal expansion test in the range of 20-250C shows that adding AlN nanowires can effectively reduce the thermal expansion coefficient of Al, and the thermal expansion coefficient of the composite material containing 10.5% AlN nanowires is 11.75×10 -6 / K, which is 47.3% lower than that of the matrix without nanowires.

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Abstract

The present invention relates to a high-strength low-thermal-expansion AlN nano-wire and an Al composite material. On the basis of AlN nano-wire with a purity of more than 95%, a high-density AlN nano-wire / Al composite material is prepared by melting point hotpressing method, Al nano-grains are prepared by H2 by arc discharge method; with Al, AlCl3, Al2O3 and NH3 as the reactants, AlN nano-fiber at gram level is deposited on a quartz substrate by gas phase CVD method, which is a monocrystalline AlN nano-wire with a purity of 95%, the diameter is between 10nm and 50nm, 1-15% by volume of AlN nano-wire and Al nano-grains are uniformly mixed, the dried mixing powder is hotpressed into a block. AlN nano-wire is evenly dispersed in a matrix, the interface is well bonded, AlN nano-wire is an idea intensifier for optimizing the force property and thermophysical property of metal-matrix electronic composite material, the AlN nano-wire and Al composite material are hopeful to be high-strength low-thermal-expansion new electronic packaging material.

Description

technical field [0001] The invention relates to the field of nanometer materials, and in particular provides an AlN nanowire and Al composite material with high strength and low thermal expansion. Background technique [0002] Aluminum-based materials have become widely used structural and functional materials because of their high specific strength, specific stiffness and corrosion resistance; aluminum nitride (AlN) materials have high strength, high temperature resistance, corrosion resistance, and high thermal conductivity. It is an ideal reinforcement material, electronic component substrate and packaging material [1] . With the rapid development of aerospace, integrated circuit and automobile manufacturing industries, the traditional simple, single, multi-phase or conventional composite aluminum matrix and aluminum nitride materials can no longer meet the requirements. Contents of the invention [0003] The purpose of the present invention is to provide a high-stren...

Claims

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Application Information

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IPC IPC(8): C22C49/00C22C49/06C22C49/14C22C47/14C22C101/08
Inventor 丛洪涛唐永炳成会明
Owner INST OF METAL RESEARCH - CHINESE ACAD OF SCI
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