Novel full-press high-power IGBT multi-mode rack porcelain tube shell

Abstract

The invention relates to a novel full-crimping high-power IGBT multi-mould-frame ceramic tube shell, suitable for being used as package shell of the full-crimping high-power IGBT multi-mould-frame element, comprising an big anode flange (1), a ceramic ring (2), a small anode flange (3), mould frame group (5), a cathode plugging sheet (4) and a gate level lead tube; the big anode flange (1), the ceramic ring (2) and the small anode flange (3) are sequentially stacked up to down as a concentric sealing; the mould frame group (5) is sealed in a central hole of the small anode flange (3), the mould frame group (5) comprises several diode chip mould frames (5-1) and a plurality of IGBT chip mould frames (5-2), the cathode plugging sheet (4) is plugged on the external surface of the small anode flange (3), the gate level lead tube is sleeved over the shell wall of the ceramic ring (2), the gate level lead tube is composed of a gate level conducting core (9), a gate level jacket (6), a gate level sealing cover (8), a gate level external plugging sheet (7) and a gate level internal plugging sheet (10). The novel full-crimping high-power IGBT multi-mould-frame ceramic tube shell according to the invention is capable for enhancing radiation effect and realizing a small volume for the finished element.

Description

technical field [0001] The invention relates to a novel fully crimped high-power IGBT multi-mode ceramic shell. It is especially suitable to be used as the encapsulation shell of full crimping high-power IGBT devices. It belongs to the technical field of high-power semiconductor devices. Background technique [0002] In the second half of the 1960s, the progress of power electronic devices and their application in frequency converters made developed countries achieve great development in energy conservation by frequency control during the first world energy crisis in the early 1970s. As a green energy-saving technology, under the current global energy shortage environment, power electronics technology plays a very important role in energy conservation, mechatronics, environmental pollution reduction, raw material saving, production cost reduction, and efficiency and quality improvement. The earliest power electronic device was the thyristor. In the 1950s, the advent of th...

AI Technical Summary

Problems solved by technology

[0003] At present, the shell of the IBGT package is a module structure made of high-performance plastics. In this package structure, the IGBT chip is welded together with the thermally conductive and non-conductive BDC board by welding, and the other terminals are bonded together. The combination method is connected to the external interface. The manufacturing process of this package structure is relatively simple, but the effect of heat dissipation is not ideal.

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