Structure having high mould-release property

A mold release, mold technology, applied in the direction of electrolytic coatings, surface reaction electrolytic coatings, coatings, etc., can solve the problems of low hardness, thin coating thickness, poor mold release, etc., to achieve low friction coefficient, high material fluidity , Increase the effect of mold release

Inactive Publication Date: 2008-09-24
AU OPTRONICS CORP
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the electroforming mold used in electroforming has the disadvantages of low hardness and poor mold release
The existing technology has made some improvements to this defect, but this improvement can only increase the hardness of the mold, but cannot increase the mold release performance of the mold, and can only be used for non-metal mold master plates. When used for metal mold master plates, It will change the microstructure size of the metal mold, and also lead to a thinner functional coating, between 50nm and 70nm, and a lower service life

Method used

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  • Structure having high mould-release property
  • Structure having high mould-release property
  • Structure having high mould-release property

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Embodiment Construction

[0026] Composite nickel Teflon coating see figure 1 , the structure 1 of the mold with high releasability provided by the present invention comprises a metal mold mother plate 11 and a composite nickel-teflon (EN-PTFE) coating 13 formed on the metal mold mother plate 11, the metal mold mother plate The thickness of the plate 11 is between 0.05 mm and 10 mm, and the thickness of the composite nickel-Teflon coating 13 is between 1 μm and 100 μm. Preferably, the metal mold master plate is a pure nickel metal mold master plate. The surface finish of the metal mold core obtained by using the metal mold is high, such as figure 2 as shown, image 3 for figure 2 magnified schematic diagram.

[0027] The process of obtaining the electroformed mold core by using the structure of the mold with a high degree of mold release provided by the present invention is as follows: Figure 4 to Figure 9 shown. Such as Figure 4 As shown, a metal mold master plate 11 is first provided; then...

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Abstract

The invention provides a structure of a die with high release property, which comprises a pure nickel metal die motherboard, a stripping film which is formed on the pure nickel metal die motherboard, and an EN-PTFE coating which is formed on the metal die motherboard; the volume percentage content of the Teflon in the EN-PTFE coating is between 10 percent and 35 percent. The structure has the beneficial effect that: the structure of the die with high release property is used for the metal cavity electroforming rollover, the EN-PTFE coating of the die surface does not change the microstructure size of the cavity, at the same time, the release property of the die is increased.

Description

technical field [0001] The invention relates to a structure of a mold, in particular to a structure of a mold with high mold release properties. Background technique [0002] In the manufacturing process of optical components, electroforming is widely used for its simple processing steps, high fidelity, low equipment investment, and if the mold can be used repeatedly, the same product can be mass-produced without affecting the accuracy. However, the electroforming mold used in electroforming has the disadvantages of low hardness and poor mold release. The existing technology has made some improvements to this defect, but this improvement can only increase the hardness of the mold, but cannot increase the mold release performance of the mold, and can only be used for non-metal mold master plates. When used for metal mold master plates, It will change the microstructure size of the metal mold, and also lead to a thinner functional coating, between 50nm and 70nm, and a lower s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B15/04B32B9/00B32B33/00C25D1/10C25D1/00C25D11/00C23C30/00
Inventor 潘昆志曾兆弘朱志宏张百辰
Owner AU OPTRONICS CORP
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