Pd-containing plating solution and uses thereof

A technology of electroplating solution and content, which is applied in the field of palladium or palladium alloy film, can solve the problems of inability to obtain a dense and defect-free palladium or palladium alloy film coating, and inability to purify and purify components by assembly

Inactive Publication Date: 2008-10-15
GREEN HYDROTEC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the palladium salt plating solution formula adopted by this known electroplating technology is applied to the electroplating of porous metal carriers, a dense, defect-free palladium or palladium

Method used

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  • Pd-containing plating solution and uses thereof
  • Pd-containing plating solution and uses thereof
  • Pd-containing plating solution and uses thereof

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0042] Example 1 (palladium sulfate electroplating solution system)

[0043] A. Pretreatment of porous stainless steel carrier

[0044] After cleaning the porous stainless steel pipe with toluene and acetone and degreasing it, sawing it to a length of 15 cm and erecting it with an ordinary metal pipe on an automatic rotary welding machine, injecting 8 ml / min of argon gas into the pipe, and using argon welding to form electroplated palladium The carrier required for the membrane. The welded carrier is mechanically polished with No. 600 sandpaper to level the porous stainless steel carrier and its welding points with ordinary pipes. After mechanical polishing, it is washed with ultrasonic water and dried in an oven at 150 degrees Celsius. At this time, the helium gas of 1 absolute atmospheric pressure is used to test the flow rate of the gas passing from the inside to the outside of the carrier, and the value is about 20 liters / minute.

[0045] B. Electroplating of media layer...

example 2

[0055] Example 2 (carrier speed test)

[0056] Repeat the operating conditions and steps from A to C in Example 1, but set the current density of electroplating palladium to be 1A / dm 2 , and palladium electroplating was performed at the carrier rotation speeds of 10rpm, 50rpm, 100rpm, 200rpm and 500rpm. After the palladium film was prepared, the structure of the obtained palladium film was observed with a scanning electron microscope (SEM). Fig. 2 shows the SEM images of palladium membranes obtained under the carrier rotation speeds of 10rpm (A), 50rpm (B), 100rpm (C), 200rpm (D) and 500rpm (E) respectively. It can be found that under the same density conditions, the high A relatively dense palladium film can be produced at the carrier rotation speed.

example 3

[0057] Example 3 (palladium chloride electroplating solution system)

[0058] Carry out the electroplating of palladium film with the same step as A to C in the example 1, but adopt the plating solution composition and electroplating parameter as shown in table 4.

[0059] Table 4

[0060]

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PUM

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Abstract

The invention relates to palladium-bearing plating solution and a method for providing a palladium film or a palladium alloy film on a porous metal carrier. The method utilizes the electroplating method to prepare the palladium film or the palladium alloy film which uses porous metals as carrier, and can shorten the process time and simplify preparation procedures; simultaneously, the palladium film or the palladium alloy film prepared by the method has excellent compactness, good hydrogen brittleness resistance and high applicability.

Description

technical field [0001] The present invention relates to a palladium-containing electroplating solution and a method for preparing a palladium or palladium alloy film on a porous metal carrier by an electroplating method, which can provide a highly adherent palladium or palladium alloy film on the porous metal carrier for providing hydrogen purification or synthesis The palladium membrane tube of the catalytic reactor used. Background technique [0002] Regarding the preparation of palladium or palladium alloy thin films, currently known techniques are electroless plating, sputtering, or cold-rolled. Among them, the electroless plating process is traditionally used for the palladium or palladium alloy film plating on the porous metal carrier, as shown in Taiwan Patent Publication No. I232888 and US Patent No. 6152987. However, the electroless plating method relies on the physical adsorption of metal particles on the substrate after chemical reduction to attach the coating fi...

Claims

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Application Information

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IPC IPC(8): C25D3/50
CPCC25D3/52
Inventor 陈世忠高玉玲雷敏宏蔡仁堂
Owner GREEN HYDROTEC
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