Difference interface circuit for on-chip long lines interlinkage

A differential interface and circuit technology, applied in the field of microelectronics, can solve problems such as increasing power consumption, and achieve the effects of reducing power consumption delay product, reducing complexity and power consumption, and reducing interconnection power consumption

Inactive Publication Date: 2008-11-12
XIDIAN UNIV
View PDF0 Cites 14 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The DIFF differential low-swing interface circuit uses differential signals to transmit on the interconnection line, which improves the signal's ability to resist noise, so it can reduce the signal swing to a very low level, but it still needs to introduce a reference voltage to obtain a low voltage swing
[0013] In summary, the current research on low-swing interconnection interface circuits mainly focuses on the identification and recovery of low-swing signals, and the transmitter generally uses differential cascaded inverters to drive interconnection lines. The biggest disadvantage of the method is that it is necessary to introduce an additional reference voltage generating circuit in the chip to provide it with a lower voltage value, which leads to circuit complexity and increases power consumption

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Difference interface circuit for on-chip long lines interlinkage
  • Difference interface circuit for on-chip long lines interlinkage
  • Difference interface circuit for on-chip long lines interlinkage

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0029] refer to Figure 6 , the low-swing interface circuit of the present invention includes three parts: a transmitter, an interconnection line and a receiver, wherein:

[0030]The transmitter is mainly used to convert the full-swing signal on the chip into a low-swing signal, which is composed of a MOS current mode logic circuit MCML and a first inverter A1. The MOS current mode logic circuit MCML is composed of a first NMOS transistor N1, a second NMOS transistor N2, a fifth NMOS transistor N5, a first PMOS transistor P1 and a second PMOS transistor P2. The first NMOS transistor N1 and the second NMOS transistor N2 form a differential input circuit of N-tube logic; the fifth NMOS transistor N5 forms a constant current source connected to the source stages of the first NMOS transistor N1 and the second NMOS transistor N2, Its gate voltage is set to the power supply voltage VDD to ensure that the N5 transistor is always on; the first PMOS transistor P1 and the second PMOS t...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a differential interface circuit used in the interconnection of long on-chip wires, which is mainly solves the power consumption problem of the interconnection of the long on-chip wires. The structure of the circuit comprises a transmitter, a long interconnection wire and a receiver; wherein, the transmitter consists of an inverter (A1) and an MOS current-mode logic circuit, the transmitter used for converting the full-swing signals on chips into low-swing signals; the receiver is formed by connecting a sensitive amplifier (G), a second inverter (A2) and a third inverter (A3), the receiver is used for restoring the low-swing signals on the longer interconnection wires to the full-swing signals. The differential interface circuit of the invention can effectively reduce the power consumption of interconnection of the long on-chip wires without under the condition of introducing the external reference voltages and can be used in the long wire interconnection of system on chip (SOC) of the integrated circuit design.

Description

technical field [0001] The invention belongs to the technical field of microelectronics and relates to an integrated circuit, in particular to a differential interface circuit, which can be used for long-line interconnection of a system on chip SoC in integrated circuit design. Background technique [0002] With the continuous improvement of integrated circuit manufacturing technology, the geometric size of transistors is continuously reduced, and the number of transistors that can be integrated per unit area is continuously increased. Therefore, power consumption has increasingly become an important constraint for integrated circuit design. The low-swing and low-power differential interface circuit interconnected on-chip with long wires belongs to the low-power CMOS system-on-chip SoC, which has an important impact on the overall performance of the integrated circuit. Especially after the CMOS process enters the deep submicron stage, on-chip interconnection faces severe cha...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H03K19/0175H03K19/0944
Inventor 郝跃刘勇蔡觉平李赞司江渤
Owner XIDIAN UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products