Process for synthesizing high molecular nanometer composite material with pressure-sensitive performance and use

Abstract

The invention relates to a synthetic technology for a macromolecular nano-composite with pressure-sensitive characteristic, which is used for preparing a pressure-sensitive element with high performance and high precision. The materials with the following weight percent are uniformly mixed to prepare the uniform macromolecular nano-composite: 20 percent to 40 percent of metal nanometer material, 10 percent to 30 percent of semiconductor ceramic nanometer material and 40 percent to 70 percent of macromolecular base material; wherein, the grain diameter of the metal nanometer material and the semiconductor ceramic nanometer material is 10nm to 500nm. The synthetic technology has the positive effect that metal nanometer powder and semi-conducting ceramic nanometer powder are fully mixed with the macromolecular material to form uniform homogeneous phrase, and the surface effect and the quantum size effect of the nanometer material are used for forming macroscopical pressure-sensitive effect. The technology for combining the macromolecular nano-composite, a circuit board and a semiconductor can efficiently produce various pressure-sensitive units; the performance of the product is highly reliable and the production cost is only a fraction of the traditional method.

Description

technical field [0001] The invention relates to a polymer nanocomposite material with pressure-sensitive properties and its application in the manufacture of pressure-sensitive elements. Background technique [0002] At present, there are mainly three types of components used for overvoltage protection of electronic circuits: ceramic varistors, silicon-based semiconductor transient overvoltage protection components and polymer ESD protection components: ceramic varistors are doped with ceramics, at high temperatures Bottom sintering semiconducting, made of roasted electrodes at both ends, its main disadvantages are high energy consumption, short life, less impact resistance, and poor pressure-sensitive characteristics; silicon-based semiconductor transient overvoltage protection components use semiconductor Its main features are large product investment, high production cost, large environmental pollution, and high additional capacitance of the product; polymer ESD protectio...

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Problems solved by technology

[0002] At present, there are mainly three types of components used for overvoltage protection of electronic circuits: ceramic varistors, silicon-based semiconductor transient overvoltage protection components and polymer ESD protection components: ceramic varistors are doped with ceramics, at high temperatures Bottom sintering semiconducting, made of roasted electrodes at both ends, its main disadvantages are high energy consumption, short life, less impact resistance, and poor pressure-sensitive characteristics; silicon-based semiconductor transient overvoltage protection components use semiconductor Its main features are large product investment, high production cost, large environmental pollution, and high additional capacitance of the product; polymer ESD protection components are made of polymer materials and conductive particles to form a material with pressure-sensitive properties , the pressure-sensitive properties of the material are not good, and the repeatability is very poor

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