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Composite method for processing metallic mold with partial three-dimensional microstructure

A composite machining and metal mold technology, applied in the field of composite machining for making metal micro-molds, can solve problems such as inability to obtain effects, poor machining surface quality, and difficult control of machining accuracy, and achieve good surface quality, high machining accuracy, and long service life. Effect

Inactive Publication Date: 2008-12-24
DALIAN UNIV OF TECH
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Problems solved by technology

The problems of this technology are: due to the production, clamping and wear and tear of the micro electrodes, when the processing area is large, the processing accuracy is not easy to control, and the quality of the processing surface is poor
[0004] For the processing of metal molds with three-dimensional parts and two-dimensional microstructures in the rest, good results cannot be obtained by using any of the above technologies alone.

Method used

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  • Composite method for processing metallic mold with partial three-dimensional microstructure
  • Composite method for processing metallic mold with partial three-dimensional microstructure

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Embodiment Construction

[0014] The specific implementation manners of the present invention will be described in detail below in conjunction with the technical solutions and accompanying drawings.

[0015] This implementation takes the local modification of the polymer microfluidic chip mold as an example.

[0016] First, a quasi-LIGA process is used to fabricate a two-dimensional microstructure 2 with vertical side walls on the mold substrate 1. The process flow is as follows:

[0017] (1) In this implementation, mold base 1 is a nickel plate of 63mm * 53mm, first precision grinding, polishing the upper surface of nickel plate, then cleaning with acetone, ethanol, deionized water successively, and drying at last;

[0018] (2) Spin-coat SU-8 glue on the nickel plate;

[0019] (3) pre-baking, exposure;

[0020] (4) Middle drying and development to obtain a two-dimensional rubber mold;

[0021] (5) Micro-electroforming, the electroforming material is nickel;

[0022] (6) Grinding and polishing;

...

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Abstract

The present invention relates to a combined machining method of a metal mould with a partial three-dimensional microstructure, which belongs to the field of micromachining techniques. Combined with the quasi-LIGA micromachining technique and the tiny electric spark micromachining technique, the combined machining method resolves the problem on how to machine the metal mould with a complex microstructure, part of which is three-dimensional and the rest part of which is two-dimensional. In the technical scheme, based on the LIGA technique, a planar two-dimensional microstructure is produced on a metal baseplate; according to the tiny electric spark machining mode, tool electrodes are produced; at a specified position on the two-dimensional microstructure, the shape of the two-dimensional microstructure is modified by tiny electric sparks until a three-dimensional microstructure is formed. The combined machining method has the following advantages: the machining precision and the surface quality of the two-dimensional microstructure on the metal mould are high; the shape of the two-dimensional microstructure can be modified at a specified area in order to obtain an inclined or stepped three-dimensional microstructure or a three-dimensional microstructure with any curved surface; since the material of the mould is metal, the strength of the mould is high, and the life span is long.

Description

technical field [0001] The invention belongs to the technical field of micro-processing, and relates to a composite processing method for making metal micro-moulds by combining quasi-LIGA technology and micro-electric spark technology. Background technique [0002] Metal molds with three-dimensional microstructures have good application prospects in the field of microelectromechanical systems (MEMS). The processing force of micro-EDM technology is small, which is suitable for processing micro-devices with three-dimensional structure. For example, the magazine "Journal of Shanghai Jiao Tong University", Volume 42, No. 1, January 2008, pages 78-82, uses micro-EDM technology to process tiny hemispherical structures with a diameter of 150 μm. The problems of this technology are: due to the production, clamping and wear and tear of the micro-electrode, when the processing area is large, the processing accuracy is not easy to control, and the quality of the processing surface is ...

Claims

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Application Information

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IPC IPC(8): B23P15/24B23H9/02
Inventor 刘冲杜立群王立鼎王敏杰宋满仓刘军山刘文涛莫顺培
Owner DALIAN UNIV OF TECH
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