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Sensitive imaging composition, its preparation method and uses

An imaging composition and composition technology are applied in optomechanical equipment, removal of conductive materials by chemical/electrolytic methods, optics, etc., which can solve problems such as high cost, complicated circuit board manufacturing process, and environmental pollution, and achieve excellent The effect of heat resistance

Inactive Publication Date: 2009-01-14
深圳市容大感光科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The manufacturing process of multi-layer circuit boards is not only complicated and costly, but also produces a large amount of wastewater due to film fading, brown / black oxidation treatment, etc., which seriously pollutes the environment

Method used

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  • Sensitive imaging composition, its preparation method and uses
  • Sensitive imaging composition, its preparation method and uses

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0051] Synthesis Example 1

[0052] Add novolac epoxy resin CNE-202 (Taiwan Changchun Life Resin Factory, epoxy equivalent 210) 200g, propylene glycol methyl ether acetate (PMA) 250g, acrylic acid 69g in the reactor, heating and melting, add hydroquinone 0.5 g, 1.5g of triphenylphosphine, reacted at 110°C for 12 hours to obtain a product with an acid value of less than 5, then added 85g of tetrahydrophthalic anhydride, heated to 100°C, and reacted for 6 hours to obtain an acid value of 52mgKOH / g. Light yellow resin solution A1 with a solid content of 59%.

[0053] Synthesis Example 2

[0054] Add novolac epoxy resin CNE-202 (Taiwan Changchun Life Resin Factory, epoxy equivalent 210) 200g, propylene glycol methyl ether acetate (PMA) 250g, acrylic acid 69g in the reactor, heating and melting, add hydroquinone 0.5 g. Triphenylphosphine 1.5g, reacted at 110°C for 12 hours to obtain a product with an acid value of less than 5, then added 80g of tetrahydrophthalic anhydride, heat...

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Abstract

The invention provides a photosensitive imaging combination which is characterized in that the combination comprises a photosensitive resin, a photoinitiator, a diluent, a thermal curing agent, filler and additives; wherein, the weight percentages of the combination components are as follows: 20 to 80 percent of photosensitive resin, 0.5 to 15 percent of photoinitiator, 5 to 40 percent of diluent, 0.2 to 15 percent of thermal curing agent and 3 to 40 percent of filler. A film made of the combination is provided with better heat resistance, anti-corrosion capability and fitting capability. When the combination is applied to the inner-layer circuit preparation of multi-layer printed circuit boards, the boards with etched circuits can be directly laminated without removing anti-corrosion inks, thus directly avoiding the film-removing process and the copper face coarsening process (brownification or melanization).

Description

technical field [0001] The present invention relates to a photosensitive imaging composition, in particular to a photosensitive imaging composition which is used as a resist in the production process of printed circuit boards (PCB boards) and can be directly laminated without film fading. Its preparation method and its use. Background technique [0002] In recent years, printed circuit boards have gradually developed towards high density and high precision. The successful development of new photosensitive imaging materials has expanded the limit fine resolution originally achieved by silk screen printing technology from 200 μm to the 3 μm level of modern optical imaging technology, and enabled the development of circuit board (PCB) manufacturing from single-sided panel production to 72-layer mass production, greatly Promote the development of PCB and even electronic communication industries, thus greatly enriching and facilitating people's lives. However, with people's pur...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/028C08F290/06C08F265/02C08F265/04C08F267/04C08F2/50H05K3/06
Inventor 刘启升李长春李素芹
Owner 深圳市容大感光科技股份有限公司
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