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Surface-protective film

A technology of protective film and protective layer, which is applied in the production of lithographic forms, photoengraving process of pattern surface, electronic equipment, etc., can solve problems such as cumbersome operation and achieve the effect of preventing adhesion

Active Publication Date: 2011-12-21
KIMOTO CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, this operation is quite cumbersome, and in order to increase production, it is desirable to reduce the number of cleanings or eliminate the cleaning process

Method used

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  • Surface-protective film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0052] A coating solution for a surface protection layer with the following composition was coated on one surface of a transparent polymer film (REMIRROR: Toray Co., Ltd.) with a thickness of 6 μm by bar coating, and was cured by heating at 120° C. for 5 minutes to form A surface protection layer with a thickness of about 1 μm. Then, a coating solution for an adhesive layer having the following composition was applied on the other side, and dried to form an adhesive layer with a thickness of about 2 μm to prepare a surface protection film. A polyethylene terephthalate release film (MRB: Mitsubishi Chemical Polyester Film Co., Ltd.) having a thickness of 25 μm was attached to the adhesive layer for easy handling.

[0053]

[0054] ·Condensation reaction type silicone resin 4 parts

[0055] (KS705F: Shin-Etsu Chemical Co., Ltd., contact angle 108 degrees: solid content 30%)

[0056] ·Condensation reaction type silicone resin 60 parts

[0057] (organosilane condensate: melam...

Embodiment 2

[0069] A surface protection film was prepared in the same manner as in Example 1, except that the surface protection layer coating solution in Example 1 was replaced with the following surface protection layer coating solution.

[0070]

[0071] ·Condensation reaction type silicone resin 12 parts

[0072] (KS705F: Shin-Etsu Chemical Co., Ltd., contact angle 108 degrees: solid content 30%)

[0073] ·Condensation reaction type silicone resin 60 parts

[0074] (organosilane condensate: melamine resin: alkyd resin = 10:3:7, contact angle 80 degrees: solid content 30%)

[0075] ·Tin-based curing catalyst 0.5 parts

[0076] ·Pigment 0.1 part

[0077] (Nipsil SS-15: Tosoh Silica)

[0078] · 16 parts of methyl ethyl ketone

[0079] 16 parts of toluene

Embodiment 3

[0081] A surface protection film was prepared in the same manner as in Example 1, except that the surface protection layer coating solution in Example 1 was replaced with the following surface protection layer coating solution.

[0082]

[0083] ·Condensation reaction type silicone resin 21 parts

[0084] (KS705F: Shin-Etsu Chemical Co., Ltd., contact angle 108 degrees: solid content 30%)

[0085] ·Condensation reaction type silicone resin 60 parts

[0086] (organosilane condensate: melamine resin: alkyd resin = 10:3:7, contact angle 80 degrees: solid content 30%)

[0087] ·Tin-based curing catalyst 0.5 parts

[0088]·Pigment 0.1 part

[0089] (Nipsil SS-15: Tosoh Silica)

[0090] · 12 parts of methyl ethyl ketone

[0091] 12 parts of toluene

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Abstract

A surface-protective film which comprises a transparent polymer film, a pressure-sensitive adhesive layer formed on one side thereof, and a surface-protective layer formed on the other side, wherein the surface-protective layer is formed from a release ingredient comprising a condensation reaction type silicone resin having a contact angle with water as measured according to JIS R3257:1999 of 100° or larger and a binder ingredient comprising a condensation reaction type resin having a contact angle with water as measured according to JIS R3257:1999 of 90° or smaller. Preferably the condensation reaction type resin having a contact angle with water as measured according to JIS R3257:1999 of 90° or smaller comprises a condensation reaction type silicone resin. This surface-protective film can retain extremely high releasability from photoresists.

Description

[0001] technology area [0002] The present invention relates to a peelable surface protection film, in particular to a manuscript (photolithographic mask) suitable for exposure to an adhesive photoresist in a printed circuit board manufacturing process and the like. ) surface protective film on the surface. Background technique [0003] Generally, a printed wiring board or a resin relief plate is produced by adhering to an adhesive photoresist such as a liquid photoresist and exposing a photolithographic mask (exposure manuscript). Therefore, if some treatment is not performed on the surface of the photoresist mask, after exposure, when the photoresist mask is peeled off from the photoresist, part of the photoresist will adhere to the photoresist mask. Even if the surface is wiped, it will remain on the photolithography mask, which will cause a problem of poor exposure accuracy. For the above reasons, a peelable surface protection film has been provided on the side of the p...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F1/14B32B27/00G03F7/20G03F1/48
CPCB32B27/08B32B2457/08B32B27/28B32B2307/748G03F7/2014G03F7/11B32B2307/412B32B27/00C09D183/04G03F7/14G03F7/20
Inventor 梶谷邦人今村顺一
Owner KIMOTO CO LTD
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