Plate-type heat-pipe radiator and use thereof

Abstract

The invention provides a plate-type heat pipe radiator and applications thereof in a portable computer. In the radiator of the invention, the heat pipe (1) adopts a plate-type structure such that an air convection extended heat-exchange surface (3) (namely a rib) provided thereon surrounds and faces an impeller (3) of a fan (4), thus saving a fan housing and occupied space and cost thereof, shortening distance for heat transfer in the heat pipe (1) and compacting the radiator to a large extent. The heat dissipating capacity is further improved by incorporating strengthened convection heat transfer structure and setting the rib in accordance with aerodynamics. The radiator has lessened mounting limit on a main board (7), which can realize series standardization of the radiator. Three portable computers are set forth using the inventive radiator, thus making the computer performance higher, lighter, lower in cost and more convenient for users on the basis of enhancement of heat dissipating capacity.

Description

Technical field [0001] The invention relates to a device for dissipating heat from an electronic device, especially a device with a flat shape, which adopts a heat pipe and a centrifugal fan, and is mainly used for heat dissipation of an electronic chip (such as CPU or GPU) in a portable electronic product such as a portable (notebook) computer. Background technique [0002] The thickness of the portable computer is required to be thinner and thinner, the performance is continuously improved, and the heat generation is increasing, especially the heat generation of the central processing unit chip CPU and the image processor chip GPU is significantly increased, and heat dissipation has become a bottleneck for the performance improvement and development of the portable computer The heat sink is like a volute that cannot be thrown away on the back of a snail. It is pasted on the CPU or GPU chip. The volume of the heat sink has occupied a considerable space in the portable comput...

AI Technical Summary

Problems solved by technology

The problems of such a radiator are: the air outlet is concentrated, if it is blocked, the heat will not come out; the air driven by the fan passes through the ribs and is directly discharged without further use; the fan cover occupies most of the space of the fan, and is Empty, in order to reduce the space occupied by the windshield, the windshield is not a standard volute shape, so the air vortex loss is very large, and the air flow distribution at the air outlet is uneven, which is not good for heat dissipation

[0004] The heat pipes in the existing radiators are all tubular structures, and the bending radius of the tubular structures is limited, which is not conducive to the compactness of the radiator

In order to reduce the thickness, flat tubes are used, but if the tube heat pipe is too flat, the flow area of ​​the working medium in the heat pipe will be reduced, and the heat transfer capacity of the heat pipe will be reduced, so the thickness of the tube heat pipe is limited, which affects the radiator. The thickness is reduced

[0005] Due to the heat dissipation problem of the CPU or GPU chip, the radiators in the current notebook computers cannot be standardized in series, and the internal structure layout of the computer is ever-changing. Different series have completely different design layouts. Even if the same series, due to the function and performance improvement , a major change had to be made simply because of thermal issues

This makes the product design cost high and the mold cost high, causing the performance of the notebook computer to be far inferior to that of the desktop computer, but the price is higher than that of the desktop computer.

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