High magnetic conductive low temperature sintered NiCuZn ferrite material

A ferrite material, low-temperature sintering technology, applied in the direction of inorganic material magnetism, can solve the problems of easy re-agglomeration, particle size reduction, and cost reduction, and achieve the effects of improving mechanical strength, increasing sintering density, and reducing manufacturing costs
CN101388268BInactive Publication Date: 2011-02-09SHANDONG ZHONGRUI ELECTRONICS
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
SHANDONG ZHONGRUI ELECTRONICS
Publication Date
2011-02-09
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention relates to a NiCuZn ferrite material with high magnetic permeability and low-temperature sintering, whose main phase is a spinel structure, the compositions which are calculated through oxide content are that Fe2O3 is 41-52.8mol%, ZuO is 20-45mol%, and CuO is 1-14mol%, NiO is 2-15mol%. MoO3 and In2O3 are used as additive based on the above materials, MoO3: 0.15wt%-0.25wt% is added, and In2O3: 0.12wt%-0.45wt% is added. Ferrite blanks which are prepared are put in a furnace to be sintered, the sintering temperature is 910-950 DEG C, the sintering time is 6-20 hours, and the temperature is kept for 2-4 hours.
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Description

technical field

[0001] The invention relates to a preparation method of high magnetic permeability low-temperature sintered NiCuZn ferrite material. Background technique

[0002] With the continuous development of electronic equipment in the direction of miniaturization, light weight, and thinning, in addition to adapting to modern communications, network technology, computers, audio-visual equipment, electronic office equipment, automotive electronic systems, military and aerospace electronics, and electromagnetic compatibility (EMC) In recent years, developed countries have invested a lot of human and financial resources to research and develop chip technology for electronic components. Chip inductors, one of the three major passive devices, have also made great progress.

[0003] Structurally, there are two types of chip inductors, one is a laminated chip inductor, and the other is a wire-wound chip inductor. Each of these two chip inductors has its outstanding advantag...

Claims

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