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Photopolymerization initiator, photosensitive composition, photosensitive film, photosensitive laminate, method of forming permanent pattern and printed board

A technology of photopolymerization initiator and photosensitive composition, which is applied in the fields of photopolymerization initiator, photosensitive composition, photosensitive film, photosensitive laminate, permanent pattern formation and printed circuit board, and can solve the problems that have not been provided yet. question

Active Publication Date: 2009-04-15
FUJIFILM CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Therefore, there has not been provided a photopolymerization initiator that can further improve the sensitivity of the photosensitive composition using an oxime ester in order to be able to cope with laser exposure, and that can improve the resolution, storage stability, surface Hardness and dielectric properties are kept good, and the photosensitive composition, photosensitive film, photosensitive laminated body, and high-definition permanent pattern (protective film, layer) using the aforementioned photosensitive laminated body have not been provided yet. interlayer insulating film and solder resist pattern, etc.) and the printed circuit board patterned by the above-mentioned permanent pattern forming method, so further improvement is desired

Method used

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  • Photopolymerization initiator, photosensitive composition, photosensitive film, photosensitive laminate, method of forming permanent pattern and printed board
  • Photopolymerization initiator, photosensitive composition, photosensitive film, photosensitive laminate, method of forming permanent pattern and printed board
  • Photopolymerization initiator, photosensitive composition, photosensitive film, photosensitive laminate, method of forming permanent pattern and printed board

Examples

Experimental program
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Embodiment

[0685] Next, examples of the present invention will be described, but the present invention is not limited to the following examples.

Synthetic example 1

[0687] -Synthesis of Compound Example 1-

[0688] 2.2 parts by mass of sodium hydride (mineral oil had been removed) was added to a 100 ml three-necked flask, and after changing to a nitrogen atmosphere, 30 parts by mass of tetrahydrofuran (THF) was added. Then, a solution of 12 parts by mass of propiophenone and 30 parts by mass of THF was added from the dropping funnel over 1 hour. Thereafter, it was stirred for 1 hour. 3.2 parts by mass of an intermediate product were obtained by producing by silica gel column chromatography (hexane / ethyl acetate=9 / 1).

[0689] Then, a solution of 12 parts by mass of allyl bromide and 15 parts by mass of THF was added from the dropping funnel over 1 hour. Then, it stirred for 1 hour, added 150 mass parts of water, and added 50 mass parts of ethyl acetate, and extracted. The solvent of the organic layer was distilled off under reduced pressure, and produced by silica gel column chromatography (hexane / ethyl acetate=9 / 1) to obtain 5.2 parts...

example 3

[0699] -Synthesis of Compound Example 3-

[0700] 2.6 parts by mass of sodium hydride (mineral oil had been removed) was added to a 100 ml three-necked flask, and after changing to a nitrogen atmosphere, 50 parts by mass of tetrahydrofuran and 20 parts by mass of dimethylacetamide were added. Then, 8.3 parts by mass of diethyl carbonate was added.

[0701] The external temperature was set to 50° C., and a solution of 7 parts by mass of 1-indanone and 8 parts by mass of THF was added from the dropping funnel over 1 hour. Thereafter, it was stirred for 1 hour.

[0702] Then, a solution of 13 parts by mass of allyl bromide and 15 parts by mass of THF was added from the dropping funnel over 1 hour. Then, it stirred for 1 hour, added 150 mass parts of water, and added 50 mass parts of ethyl acetate, and extracted. The solvent of the organic layer was distilled under reduced pressure, and 4.6 parts by mass of 48% aqueous sodium hydroxide solution, 20 parts by mass of ethanol, and...

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Abstract

A photopolymerization initiator that for permitting responding to laser exposure, realizes an enhancement of sensitivity of photosensitive composition and maintaining of favorable resolution, storage stability, surface hardness and dielectric performance with respect to the composition; employing the photopolymerization initiator, a photosensitive composition, photosensitive film and photosensitive laminate; a method of forming superfine permanent pattern (protective film, interlayer insulating film and solder resist patterns, etc.) with the use of the photosensitive laminate; and a printed board having a pattern formed by the above method of forming permanent pattern. There is provided a photopolymerization initiator being an oxime ester compound having a specified unsaturated group. Further, there are provided, containing the photopolymerization initiator, a photosensitive composition, photosensitive film and photosensitive laminate. Still further, there are provided a method of forming permanent pattern with the use of the photosensitive laminate; and a printed board having a pattern formed by the above method of forming permanent pattern.

Description

technical field [0001] The present invention relates to a photopolymerization initiator capable of further improving the sensitivity of a photosensitive composition so that it can respond to laser exposure, a photosensitive composition using the same, a photosensitive film, a photosensitive laminate, and a high-definition permanent pattern (protective film, interlayer insulating film, solder resist pattern, etc.) and a printed circuit board with a permanent pattern formed by the permanent pattern forming method. Background technique [0002] In the field of printed wiring boards, components such as semiconductors, capacitors, and resistors are mounted on printed wiring boards by soldering. In this case, for example, in a soldering process such as IR reflow, in order to prevent solder from adhering to parts that do not require soldering, a method of forming a permanent pattern corresponding to the above-mentioned parts that do not require soldering as a protective film or an ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08F2/50G03F7/031
CPCG03F7/0007C08F2/50G03F7/031C07C251/38
Inventor 田村崇藤田明德池田贵美
Owner FUJIFILM CORP