Photo-curing resin composition, design of cured composition and printed circuit board
A technology of photocurable resin and photosensitive resin, which is applied in the secondary processing of printed circuits, optics, and optomechanical equipment. left and right
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[0143] Hereinafter, the present invention will be specifically described by showing examples, but the present invention is not limited to the following examples.
[0144]
[0145] Resin Synthesis Example 1 (A-1)
[0146] Add 442.2 parts (3.3 moles) of dimethylolpropionic acid, 1031.8 parts (6.7 moles) of methacrylic anhydride, 3.0 parts of methyl hydroquinone, and 8.5 parts of triphenylphosphine to 600 g of diethylene glycol monoethyl ether acetate , reacted at 95°C for 8 hours. Next, 800 g of diethylene glycol monoethyl ether acetate, 2140 g (number of glycidyl groups (total number of aromatic rings): 10.0 mol) o-cresol novolak type epoxy resin [manufactured by Dainippon Ink Chemical Industry Co., Ltd., EPICLON N- 695, softening point 95°C, epoxy equivalent 214, average functional group number 7.6], 3.0 parts of methyl hydroquinone, 1000 parts of carbitol acetate, heated to 90°C while stirring to dissolve the reaction mixture. Next, the reaction liquid was cooled to 60° C...
Embodiment 1
[0163] Using the resin solution in the above synthesis example, the various components shown in Table 1 were blended in various proportions (parts by mass), pre-mixed with a mixer, and then kneaded with a 3-roller mill to prepare a photocurable resin. combination. Here, the degree of dispersion of the obtained photocurable resin composition was evaluated by measuring the particle size with a Grind meter manufactured by ERICHSEN, and it was 15 μm or less.
[0164] Table 1
[0165]
[0166] Performance evaluation:
[0167]
[0168] After polishing a circuit pattern substrate with a copper thickness of 35 μm, grinding, washing, and drying, the above-mentioned photocurable resin compositions prepared are applied to the entire surface by screen printing, and dried in a hot air circulation drying oven at 80°C 30 minutes. After drying, use a direct drawing device equipped with a semiconductor laser with a maximum wavelength of 355nm (Paragon8000 manufactured by Orbotech), a d...
Embodiment 2
[0219]
[0220] Composition Example 1 used in Example 1 was diluted with methyl ethyl ketone, applied on a PET film, and dried at 80° C. for 30 minutes to form a photosensitive resin composition layer with a thickness of 20 m. Furthermore, a cover film was bonded thereon to obtain a dry film. Thereafter, the cover film was peeled off, and the film was thermally laminated on the patterned copper foil substrate, followed by exposure under the same conditions as the substrate used for the evaluation of coating film properties in Example 1. The exposed carrier film was peeled off, and heat-cured for 60 minutes with a 150 degreeC hot-air drier, and the test board|substrate was produced. With respect to the obtained test substrate having the cured film, evaluation tests of various characteristics were performed by the above-mentioned test method and evaluation method. The results are shown in Table 3.
[0221] table 3
[0222] (composition example) example 1 High ...
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