Check patentability & draft patents in minutes with Patsnap Eureka AI!

Preparation of nano zinc oxide modified organosilicon encapsulation adhesive

A technology of nano-zinc oxide and organic silica gel, applied in chemical instruments and methods, and other chemical processes, can solve the problems of low transparency and large filling volume of packaging glue, and achieve the effect of achieving thermal conductivity and refractive index

Active Publication Date: 2011-03-30
JIANGSU TIANHENG NANO SCI & TECH
View PDF0 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the polymer matrix is ​​filled with metal oxides (magnesia, alumina) and metal nitrides (aluminum nitride, boron nitride) to improve the thermal conductivity of polymer packaging materials. Disadvantages of less transparency

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0015] Dissolve 0.01g of γ-glycidoxypropyltrimethoxysilane in a certain amount of toluene at room temperature, add 100g of nano zinc oxide, reflux at 110°C for 4h under stirring, and place in an oven to volatilize the remaining Small organic molecules are used to obtain modified nanometer zinc oxide.

[0016] Take 0.02g of modified nano-zinc oxide, 100g of α, ω-dihydroxy polydimethylsiloxane, stir and mix the two fully, add 5g of curing agent ethyl orthosilicate, catalyst dibutyltin dilaurate 0.5g g. After mixing evenly, pour the sample into the mold and solidify at room temperature.

[0017] The thermal conductivity of the silicone lens glue prepared in this example is 6.1% higher than that of the silicone lens glue not filled with nano zinc oxide and directly cured, and its refractive index is 0.1% higher than that of the silicone lens glue not filled with nano zinc oxide.

Embodiment 2

[0019] Dissolve 0.01g of γ-glycidoxypropyltrimethoxysilane in a certain amount of toluene at room temperature, add 100g of nano zinc oxide, reflux at 110°C for 4h under stirring, and place in an oven to volatilize the remaining Small organic molecules are used to obtain modified nanometer zinc oxide.

[0020] Take 0.07g of modified nano-zinc oxide, 100g of α, ω-dihydroxypolydimethylsiloxane, stir and mix the two fully, add 5g of curing agent tetraethyl orthosilicate, and 0.5g of catalyst dibutyltin dilaurate. g. After mixing evenly, pour the sample into the mold and solidify at room temperature.

[0021] The thermal conductivity of the silicone lens glue prepared in this example is 0.205W / (mK), which is 24.2% higher than that of the silicone lens glue that is not filled with nano-zinc oxide and directly solidified, and its refractive index is higher than that of the silicone lens glue that is not filled with nano-zinc oxide. Improve by 3.5%.

Embodiment 3

[0023] Dissolve 0.01g of γ-glycidoxypropyltrimethoxysilane in a certain amount of toluene at room temperature, add 100g of nano zinc oxide, reflux at 110°C for 4h under stirring, and place in an oven to volatilize the remaining Small organic molecules are used to obtain modified nanometer zinc oxide.

[0024] Take 0.15g of modified nano-zinc oxide, α, ω-dihydroxypolydimethyldiphenylsiloxane 100g, stir and mix the two fully, add 5g of curing agent orthosilicate, catalyst dilaurate dilaurate Butyl tin 0.5g, mixed evenly, poured into the mold and solidified at room temperature.

[0025] The thermal conductivity of the silicone lens glue prepared in this example is 38.2% higher than that of the silicone lens glue not filled with nano zinc oxide and directly cured, and its refractive index is 4.5% higher than that of the silicone lens glue not filled with nano zinc oxide.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
optical clarityaaaaaaaaaa
Login to View More

Abstract

The invention relates to a preparation method for organic silicon rubber for encapsulation modified by nano zinc oxide, which pertains to the technical field of encapsulation materials of photoconducting devices. The key points of the method are as follows: firstly, a surface treating agent with certain concentration, i.e., a silane coupler solution, is prepared and used for modifying the nano zinc oxide; then the nano zinc oxide after modification is filled into the organic silicon rubber, thus obtaining the organic silicon rubber for encapsulation. The mass ratio of the adding quantity of the nano zinc oxide and that of organic silicon rubber is (0.01 to 0.15):100. After stirring and mixing, small quantity of hardeners and catalysts are added and continue to be stirred and mixed evenly;and the organic silicon rubber for encapsulation modified by nano zinc oxide is finally obtained. The organic silicon rubber for encapsulation prepared by the method can promote heat conducting rate by 6 percent to 38 percent and refractive index by 0.1 percent to 4.5 percent and has an optical transparency higher than 95 percent.

Description

Technical field: [0001] The invention relates to a preparation method of nano-zinc oxide modified organic silicon encapsulation glue, which belongs to the technical field of encapsulation materials for optoelectronic devices. Background technique: [0002] With the increasing luminous efficiency of light-emitting diodes (LEDs), especially the successful development of white light-emitting diodes, it has become a reality to partially replace incandescent lamps and fluorescent lamps with semiconductor lighting. Epoxy resin was commonly used in LED packaging before, but with the increase of LED power, the shortcomings of epoxy resin are gradually exposed, mainly manifested in hygroscopicity, easy aging, poor heat resistance, easy to change color under high temperature and short-wave radiation, easy to Cracking, etc., affects the life of the LED device. Therefore, other alternative packaging materials must be sought in the packaging of high-power LEDs. Among them, silicone mat...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C08L83/06C08K9/06C09K3/10
Inventor 贺英张文飞王均安谌小斑张晨晨
Owner JIANGSU TIANHENG NANO SCI & TECH
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More