CN group-containing organosilane co-polymer modified cyanate ester resin and preparation method thereof
A cyanate resin and copolymer modification technology, applied in the field of polymers and their processing, can solve the problems of sacrificing heat resistance, insignificant toughening effect, toughening and other problems, and achieve excellent heat resistance and dielectric properties , good mechanical properties, good dielectric properties
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment 1
[0028] Add 100 parts of bisphenol A cyanate resin and 6 parts of CN group-containing organosilicon copolymer into acetone, and after being completely dissolved, heat and distill to remove the organic solvent. Pre-polymerize at 80-120°C, the pre-polymerization time is 10-50 minutes; then pour it into a preheated mold, vacuumize to remove air bubbles, and put it in an oven for curing. The curing temperature is controlled at 100-220°C, and the curing time is controlled at 6-12 hours. That is, the CN group-containing organosilicon copolymer modified cyanate resin is obtained.
Embodiment 2
[0030] Add 100 parts of cyclopentadiene-type cyanate resin and 8 parts of CN group-containing organosilicon copolymer into acetone, and after they are completely dissolved, heat and distill to remove the organic solvent. Pre-polymerize at 80-120°C, the pre-polymerization time is 10-50 minutes; then pour it into a preheated mold, vacuumize to remove air bubbles, and put it in an oven for curing. The curing temperature is controlled at 100-220°C, and the curing time is controlled at 6-12 hours. That is, the CN group-containing organosilicon copolymer modified cyanate resin is obtained.
Embodiment 3
[0032] Add 100 parts of bisphenol A cyanate resin and 10 parts of CN group-containing organosilicon copolymer into acetone, and after they are completely dissolved, heat and distill to remove the organic solvent. Pre-polymerize at 80-120°C, the pre-polymerization time is 10-50 minutes; then pour it into a preheated mold, vacuumize to remove air bubbles, and put it in an oven for curing. The curing temperature is controlled at 100-220°C, and the curing time is controlled at 6-12 hours. That is, the CN group-containing organosilicon copolymer modified cyanate resin is obtained.
[0033] The performance index of the CN-based organosilicon copolymer modified bisphenol A type cyanate resin of the present invention is as follows:
[0034] Impact strength: >13KJ / m 2 ;Bending strength: >120Mpa;
[0035] Dielectric constant: <2.98; dielectric loss tangent Tanδ: <0.014;
[0036] Glass transition temperature: >250°C; initial thermal decomposition temperature°C: >410°C;
[0037] The ...
PUM
Property | Measurement | Unit |
---|---|---|
impact strength | aaaaa | aaaaa |
bending strength | aaaaa | aaaaa |
glass transition temperature | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com